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Descrizione libro Hardcover. Condizione: new. New. Fast Shipping and good customer service. Codice articolo Holz_New_0815515545
Descrizione libro Hardcover. Condizione: New. Codice articolo 6666-ELS-9780815515548
Descrizione libro Condizione: new. Questo è un articolo print on demand. Codice articolo eb1139e51feefeaf37fe87a50fbbe1b9
Descrizione libro Paperback. Condizione: Brand New. 2nd edition. 718 pages. 8.75x6.50x1.00 inches. In Stock. Codice articolo __0815515545
Descrizione libro Condizione: New. Book is in NEW condition. Codice articolo 0815515545-2-1
Descrizione libro Condizione: New. New! This book is in the same immaculate condition as when it was published. Codice articolo 353-0815515545-new
Descrizione libro Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits, this handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, res. Codice articolo 595054862
Descrizione libro Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Codice articolo 9780815515548