High Performance Printed Circuit Boards - Rilegato

Harper, Charles

Rilegato

ISBN 10: 0070267138 ISBN 13: 9780070267138

Casa editrice: McGraw-Hill Education, 2000

Riassunto

• A guided tour through the new generation of high-performance printed circuit boards (PCBs) and ceramic substrates
• Packed with leading-edge information, including data, details and guidelines on microvias, built-up multi-layers, high-density boards, and advanced ceramic substrates
• Covers environmentally safe PCB materials and processes
• Essential for electronics engineers, designers, and technicians--plus manufacturing and mechanical engineers

Su questo libro

Informazioni sull?autore

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

Dettagli dell'edizione

• Editore: McGraw-Hill Education
• Data di pubblicazione: 2000
• Lingua: Inglese
• ISBN 10: 0070267138
• ISBN 13: 9780070267138
• Rilegatura: Copertina rigida
• Numero di pagine: 512
• Contatto del produttore: non disponibile
• Persona responsabile: Ufficio Anagrafiche Messaggerie; 0039 0245774342; ufficio.anagrafiche@meli.it; ; Via Verdi, 8.; Assago Milano; 20090; Italia