CHIP SCALE PACKAGE, CSP - Rilegato

Lau, John H.; Lee, Ricky S.W.

Rilegato

ISBN 10: 0070383049 ISBN 13: 9780070383043

Casa editrice: McGraw-Hill Professional, 1999

Riassunto

The first comprehensive, in-depth guide to chip scale packaging, this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT). Featuring the latest design techniques, plus details on more than 40 different types of CSP, Chip Scale Package hands engineers and designers the complete, professional set of working tools that they need to solve technical and design issues; find the most efficient, cost-effective CSP solutions for their deployments; answer questions on interfacing, speed, robustness, and more; compare properties of wirebonds, flip chips, rigid and flex substrates, wafer-level redistribution, and other CSP products; get the latest information on new offerings from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, National Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and other major companies; and learn about CSP products under development. A revolution in electronics, CSP is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Chip Scale Package, youÕll see why itÕs the resource of choice for those who want to be at the top of the game.

Su questo libro

L'autore:

John H. Lau is president of Express Packaging Systems, Inc., and one of the foremost educators on electronic packaging worldwide. He and his company are based in Palo Alto, California. S-W. Ricky Lee is a widely known expert and lecturer on electronic packaging. He is a mechanical engineering faculty member at Hong Kong University of Science and Technology.

Contenuti:

Part I: Flip Chip and Wire Bond for CSP.

Solder-Bumped Flip Chip and Wire-Bonding Chip on CSP Substrate.

Part II: Customized Leadframe Based CSPs.

Fujitsu's Small Outline No-Lead/C-Lead Package (SON/SOC).

Fujitsu's Bump Chip Carrier (BCC).

Fujitsu's MicroBGA and Quad Flat Nonleaded Package (QFN).

Hitachi Cable's Lead-on-Chip Chip Scale Package (LOC-CSP).

Hitachi Cable's Micro Stud Array Package (MSA). LG

Semicon's Bottom-Leaded Plastic Package (BLP).

TI Japan's Memory Chip Scale Package with LOC (MCSP).

Part III: CSPs with Flexible Substrate.

3M's Enhanced Flex CSP.

General Electric's Chip-on-Flex Chip Scale Package (COF-CSP).

Hitachi's Chip Scale Package for Memory Devices.

IZM's flexPAC.

NEC's Fine-Pitch Ball Grid Array (FPBGA).

Nitto Denko's Molded Chip Size Package (MCSP).

Sharp's Chip Scale Package.

Tessera's Micro-Ball Grid Array.

TI Japan's Micro-Star BGA.

TI Japan's Memory Chip Scale Package with Flexible Substrate (MCSP).

Part IV: CSPs with Rigid Substrate.

Amkor/Anam's ChipArray Package.

EPS's Low-Cost Solder-Bumped Flip Chip NuCSP.

IBM's Ceramic Mini-Ball Grid Array

Package (Mini-BGA).

IBM's Flip Chip-Plastic Ball Grid Array Package (FC/PBGA).

Matsuhita's MN-PAC.

Motorola's SLICC and JACS-Pak.

National Semiconductor's Plastic Chip Carrier (PCC).

NEC's Three-Dimensional Memory Module (3DM) and CSP.

Sony's Transformed Grid Array Package (TGA).

Toshiba's Ceramic/Plastic Fine-Pitch BGA Package (C/P-FBGA).

Part V: Wafer-Level Redistribution CSPs.

ChipScale's Micro SMT Package (MSMT).

EPIC's Chip Scale Package.

Flip Chip Technologies' UltraCSP.

Fujitsu's Super CSP (SCSP).

Mitsubishi's Chip Scale Package (CSP).

National Semiconductor's SMD.

Sandia National Laboratories' Mini Ball Grid Array Package (mBGA).

ShellCase's Shell-PACK/Shell-BGA.

Su questa edizione

• Editore: McGraw-Hill Professional
• Data di pubblicazione: 1999
• ISBN 10: 0070383049
• ISBN 13: 9780070383043
• Rilegatura: Copertina rigida
• Numero di pagine: 564