Quantum-Well Laser Array Packaging: Nanoscale Pckaging Techniques - Rilegato

Tomm, Jens W.; Jiménez, Juan

Rilegato

ISBN 10: 0071460322 ISBN 13: 9780071460323

Casa editrice: McGraw Hill, 2006

Riassunto

Quantum-well lasers offer the promise of lightning-fast data communications 10-to-100 times faster than broadband

While the architecture for these devices already exists, they suffer from material packaging problems. In this book the authors address this critical issue by providing researchers with state-of-the-art screening and packaging techniques not found in any other resource.

Key features

Degradation signatures occurring in high power laser bars exposed to high optical power densities

Failure prediction for different types of laser bars and technologies

Screening methodologies in high power laser bars with a classification of detected defects

In-depth degradation analysis of bars and single emitters

Su questo libro

L'autore:

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

McGraw-Hill authors represent the leading experts in their fields and are dedicated to improving the lives, careers, and interests of readers worldwide

Dalla quarta di copertina:

THE LATEST PACKAGING SOLUTIONS FOR QUANTUM-WELL LASERS

This groundbreaking reference presents state-of-the-art packaging techniques for high-power quantum-well laser arrays. These devices, with continuous-wave emission powers of several hundred watts, represent the most effective converters from electric energy into light ever created. Edited by two leading experts in the field, Quantum-Well Laser Array Packaging covers all critical issues related to material packaging problems and includes unique screening and packaging techniques not found in any other resource.

• Get a complete overview of quantum-well laser diode array degradation
• Examine innovative methods of strain measurement
• Learn new imaging techniques for laser facet inspection
• Explore promising directions in screening and failure prediction
• Discover improved packaging techniques for reducing external stresses
• Review current research on degradation modes and related defects in high-power laser bars

INSIDE Quantum-Well Laser Array Packaging

Overview of Laser Diode Degradation Mechanisms · Strain Measurement · Laser Facet Inspection by Imaging Techniques · Failure Prediction of High-Power Laser Bars · Reduction of External Stresses by Improved Packaging Techniques · Degradation Modes and Related Defects in High-Power Laser Bars

Su questa edizione

• Editore: McGraw Hill
• Data di pubblicazione: 2006
• ISBN 10: 0071460322
• ISBN 13: 9780071460323
• Rilegatura: Copertina rigida
• Numero di pagine: 428