Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.
The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.
The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.
As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:
· Tamper-proof adhesives for electronic security devices.
· Bio-compatible adhesives for implantable medical devices.
· Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).
· Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157) . The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery ad Development of Onium Salt Cationic Photoinitiators, J. Polymer Chemistry (1999)
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Spese di spedizione:
EUR 11,13
Da: Italia a: U.S.A.
Descrizione libro Condizione: new. Questo è un articolo print on demand. Codice articolo dbeb13dc4334336890d51560ccdd7e16
Descrizione libro Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: . Tamper-proof adhesives for electronic security devices. . Bio-compatible adhesives for implantable medical devices. . Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). . Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. Englisch. Codice articolo 9780128103708
Descrizione libro Paperback. Condizione: Brand New. 2nd edition. 414 pages. 9.00x6.00x1.00 inches. In Stock. Codice articolo __0128103701
Descrizione libro Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of elect. Codice articolo 594362458
Descrizione libro Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: . Tamper-proof adhesives for electronic security devices. . Bio-compatible adhesives for implantable medical devices. . Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). . Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. Codice articolo 9780128103708
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