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Unique in approach, this book provides an integrated view of silicon technology--with an emphasis on modern computer simulation. It describes not only the manufacturing practice associated with the technologies used in silicon chip fabrication, but also the underlying scientific basis for those technologies. Modern CMOS Technology. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers. Semiconductor Manufacturing--Clean Rooms, Wafer Cleaning and Gettering. Lithography. Thermal Oxidation and the Si/SiO2 Interface. Dopant Diffusion. Ion Implantation. Thin Film Diffusion. Etching. Backend Technology. For anyone interested in Fabrication Processes.
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Unique in approach, this book provides an integrated view of silicon technology—with an emphasis on modern computer simulation. It describes not only the manufacturing practice associated with the technologies used in silicon chip fabrication, but also the underlying scientific basis for those technologies.
FEATURES/BENEFITS *Extensive use of modern computer simulation methods and examples-Integrated into each chapter. *Illustrates how technologies work. Allowing the reader to develop a better physical understanding of concepts and helps them in visualizing features of the technologies that are not easily seen any other way. *Early, broad exposure to a complete chip manufacturing process (Ch. 2). *Ties many diverse processing concepts together and establishes the context for the specific technologies discussed in later chapters. *Examples of modern manufacturing practice. *Providing readers with practical examples of fundamental concepts. *Historical perspective and introduction. *An integrated view of silicon technology-with an emphasis on modern computer simulation. *Extensive use of modern computer simulation methods and examples-integrated into each chapter. *Early, broad exposure to a complete chip manufacturing process. *Examples of modern manufacturing practice.
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Descrizione libro PaperBack. Condizione: New. international. This is an International edition, ISBN and Cover image may different from US edition, Contents same as US edition Excellent Customer Service. Codice articolo 20987
Descrizione libro Soft cover. Condizione: New. NEW - International Edition - ISBN 9788131726044 - Same Contents as in US edition - in english - 1ed - - SHRINKwrapped BOXpacked - Printed in Asia - Cover image is different from US edition - There is no CD or Access Code- unless specified above - Ships from various locations - Expedited 2 to 4 day Delivery option available -Standard shipping takes 5 to 10 business days - Tracking number is emailed for every order -You get same study contents at a fraction of US edition cost - Save Hard earned money. Codice articolo M17
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Descrizione libro Paperback. Condizione: NEW. International Edition, Paperback, Brand New, ISBN and Cover image may differ but contents similar to U.S. Edition, Printed in Black & White. End Chapter Exercises may differ. No CD/Access code. Legal to use despite any disclaimer, We ship to PO , APO and FPO adresses in U.S.A .Choose Expedited Shipping for FASTER DELIVERY.Customer Satisfaction Guaranteed. Codice articolo US_9788131726044
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