Microelectronics Packaging Handbook

Rymaszewski, Eugene J.; Klopfenstein, Alan G.

ISBN 10: 0412085615 ISBN 13: 9780412085611

Casa editrice: Kluwer Academic Pub, 1998

Riassunto

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

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Contenuti

Volume I: Microelectronics packaging design overview. Package wiring and terminals. Package electrical design. Heat transfer in electronic packages. Package reliability. package manufacture and assembly.
Volume II: Microelectronics first-level package overview. Chip-to-package interconnection. Plastic packaging. Ceramic packaging. Polymers in packaging. Thin-film packaging. First level package electrical testing. Package sealing and encapsulation.
Volume III: Microelectronics second-level and higher package overview. Package-to-board interconnections. Printed-circuit board packaging. Wiring. Coated-metal packaging. Connector and cable packaging. Optical packaging

Product Description

Providing recent advances in microelectronics design methods, modelling tools, simulation techniques and manufacturing processes, this work discusses packages that meet the power, cooling, protection and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

Dettagli dell?edizione

• Editore: Kluwer Academic Pub
• Data di pubblicazione: 1998
• Lingua: Inglese
• ISBN 10: 0412085615
• ISBN 13: 9780412085611
• Rilegatura: CD-ROM
• Numero edizione: 2
• Numero di pagine: 1000
• Redattore: Tummala Rao R.
• Contatto del produttore: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com