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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
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Contenuti
Preface. 1. Introduction; L.C. Wagner. 2. Electrical Characterization; S. Frank, et al. 3. Package Analysis: SAM and X-Ray; T.M. Moore, C. Hartfield. 4. Die Exposure; P.D. Ngo. 5. Global Failure Site Isolation: Thermal Techniques; D.L. Barton. 6. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques; E.I. Cole, D.L. Barton. 7. Probing Technology for IC Diagnosis; C.G. Talbot. 8. Deprocessing; D. Yim. 9. Cross-Section Analysis; T. Haddock, S. Boddicker. 10. Inspection Techniques; L.C. Wagner. 11. Chemical Analysis; L.C. Wagner. 12. Energy Dispersive Spectroscopy; P.D. Ngo. 13. Auger Electron Spectroscopy; R.K. Lowry. 14. Secondary Ion Mass Spectrometry, SIMS; K. Evans. 15. Failure Analysis Future Requirements; D.P. Vallett. Index.
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Failure Analysis of Integrated Circuits : Tools and Techniques
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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)
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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa. Codice articolo 5914199
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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 276 pp. Englisch. Codice articolo 9780412145612
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Failure Analysis of Integrated Circuits
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Springer US, Springer New York Jan 1999, 1999
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Buch. Condizione: Neu. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 276 pp. Englisch. Codice articolo 9780412145612
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Failure Analysis of Integrated Circuits: Tools and Techniques (The Springer International Series in Engineering and Computer Science, 494)
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Failure Analysis of Integrated Circuits : Tools and Techniques
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Springer US, Springer New York, 1999
ISBN 10: 0412145618
ISBN 13: 9780412145612
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Da: AHA-BUCH GmbH, Einbeck, Germania
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers. Codice articolo 9780412145612
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