Quality Conformance and Qualification of Microelectronic Packages and Interconnects - Rilegato

Pecht, Michael; Dasgupta, Abhijit

Rilegato

ISBN 10: 0471594369 ISBN 13: 9780471594369

Casa editrice: Wiley-Interscience, 1995

Riassunto

All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests.

This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful...
* Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata
* Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product
* Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing

A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail.

The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals.

For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp.

INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht

This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.

Su questo libro

Informazioni sull?autore

DR. MICHAEL PECHT is a ten-ured faculty member with a jointappointment in Systems Research and Mechanical Engineering, and theDirector of the CALCE Electronic Packag-ing Research Center at theUniversity of Maryland. He has an MS in electrical engineering andan MS and PhD in engineering mechanics from the University ofWisconsin. He is a Professional Engineer and an IEEE Fellow. Heserves on the board of advisors for various companies and was aWestinghouse Professor. He is the chief editor of the IEEETransactions on Reliability, on the board of advisors for IEEESpectrum, and a section editor for the Society of AutomotiveEngineering.

DR. ABHIJIT DASGUPTA is a tenured faculty member with the CALCEElectronic Packaging Research Center at the University ofMaryland.

DR. JOHN W. EVANS is a program manager of the Electronic PackagingProgram for NASA Headquarters in Washington, D.C.

JILLIAN Y. EVANS is an aerospace engineer at the NASA Goddard SpaceFlight Center Facility in Greenbelt, Maryland

PHYSICAL ARCHITECTURE OF VLSI SYSTEMS Robert Hannemann, Allan D.Kraus, and Michael Pecht

Dalla quarta di copertina

All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, qualityscreens, and tests.

This book's groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today's high-performance microelectronics. It does this with powerful...

• Techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data
• Physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product
• Process controls that decrease variabilities in the end product and reduce end-of-line screening and testing

A wide range of microelectronic package and interconnect configurations for both single-and multi-chip modules is examined, including chip and wire-bonds, tape-automated (TAB), flip-TAB, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail.

The product of a distinguished team of authors and editors, this book's guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals.

For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) 800 pp.

INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGN GUIDELINES: A Focus on Reliability —Michael Pecht

This comprehensive guide features a uniquely organized time-phased approach to design, development, qualification, manufacture, and in-service management. It provides step-by-step instructions on how to define realistic system requirements, define the system usage environment, identify potential failure modes, characterize materials and processes by the key control label factors, and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins. Topics covered include: detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals—incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions. 1993 (0-471-59446-6) 454 pp.

Dal risvolto di copertina interno

All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don’t cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of failure and the appropriate implementation of cost-effective process controls, quality screens, and tests. This book’s groundbreaking, science-based approach to developing qualification and quality assurance programs helps engineers reach a new level of reliability in today’s high-performance microelectronics. It does this with powerful…

• Techniques for identifying and modeling failure mechanisms earlier in the design cycle, breaking the need to rely on field data
• Physics-of-failure product reliability assessment methods that can be proactively implemented throughout the design and manufacture of the product
• Process controls that decrease variabilities in the end product and reduce end-of-line screening and testing

A wide range of microelectronic package and interconnect configurations for both single- and multi-chip modules is examined, including chip and wire-bonds, tape-automated (Tab), flip-Tab, flip-chip bonds, high-density interconnects, chip-on-board designs (COB), MCM, 3-D stack, and many more. The remaining package elements, such as die attachment, case and lid, leads, and lid and lead seals are also discussed in detail. The product of a distinguished team of authors and editors, this book’s guidelines for avoiding potential high-risk manufacturing and qualification problems, as well as for implementing ongoing quality assurance, are sure to prove invaluable to both students and practicing professionals.

Dettagli dell?edizione

• Editore: Wiley-Interscience
• Data di pubblicazione: 1995
• Lingua: Inglese
• ISBN 10: 0471594369
• ISBN 13: 9780471594369
• Rilegatura: Copertina rigida
• Numero di pagine: 496
• Contatto del produttore: non disponibile
• Persona responsabile: non disponibile