Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
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Spese di spedizione:
EUR 11,65
Da: Regno Unito a: U.S.A.
Descrizione libro Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. Codice articolo ria9780750693141_lsuk
Descrizione libro HRD. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Codice articolo L1-9780750693141
Descrizione libro HRD. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000. Codice articolo L1-9780750693141
Descrizione libro Condizione: New. Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. This title examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packa. Codice articolo 594942715