Articoli correlati a Handbook of Thin Film Deposition: Principles, Methods,...
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues―as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
L'autore:
Formerly Assistant Professor in Materials Science at the University of Arizona and has extensive professional experience as a technologist with both the IBM and Intel Corporations.
Contenuti:
Recent Changes in the Semiconductor Industry
Deposition Technologies and Applications: Introduction and Overview
Silicon Epitaxy by Chemical Vapor Deposition
Chemical Vapor Deposition of Silicon Dioxide Films
Metal Organic Chemical Vapor Deposition: Technology and Equipment
Feature Scale Modeling
The Role of Metrology and Inspection in Semiconductor Processing
Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing
Sputtering and Sputter Deposition
Laser and Electron Beam Assisted Processing
Molecular Beam Epitaxy: Equipment and Practice
Ion Beam Deposition
Chemical Mechanical Polishing
Organic Dielectrics in Multilevel Metalization of Integrated Circuits
Performance, Processing, and Lithography Trends
Index
Deposition Technologies and Applications: Introduction and Overview
Silicon Epitaxy by Chemical Vapor Deposition
Chemical Vapor Deposition of Silicon Dioxide Films
Metal Organic Chemical Vapor Deposition: Technology and Equipment
Feature Scale Modeling
The Role of Metrology and Inspection in Semiconductor Processing
Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing
Sputtering and Sputter Deposition
Laser and Electron Beam Assisted Processing
Molecular Beam Epitaxy: Equipment and Practice
Ion Beam Deposition
Chemical Mechanical Polishing
Organic Dielectrics in Multilevel Metalization of Integrated Circuits
Performance, Processing, and Lithography Trends
Index
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
- EditoreWilliam Andrew
- Data di pubblicazione2002
- ISBN 10 0815514425
- ISBN 13 9780815514428
- RilegaturaCopertina rigida
- Numero edizione1
- Numero di pagine430
- RedattoreSeshan Krishna
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