Articoli correlati a RF and Microwave Microelectronics Packaging
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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Dalla quarta di copertina
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:
- Presents methods and techniques used for measuring and testing of the electronic materials properties.
- Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
- Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
- Discusses thermal management issues for RF/MW packaging.
- Creates a RF/Microwave Packaging Roadmap for Portable Devices.
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
- EditoreSpringer Verlag
- Data di pubblicazione2009
- ISBN 10 1441909834
- ISBN 13 9781441909831
- RilegaturaCopertina rigida
- LinguaInglese
- Numero di pagine285
- RedattoreKuang Ken, Kim Franklin, Cahill Sean S.
- Contatto del produttorenon disponibile
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RF and Microwave Microelectronics Packaging
Da: Buchpark, Trebbin, Germania
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Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher. Codice articolo 5460110/2
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RF and Microwave Microelectronics Packaging
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents methods and techniques used for measuring and testing of the electronic materials propertiesPresents an in-depth discussion of ceramic materials for RF/MW packagingPresents numerical simulation methods and techniques used in analys. Codice articolo 4172151
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RF and Microwave Microelectronics Packa (eng)
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RF and Microwave Microelectronics Packaging
Print on DemandDa: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 285 pp. Englisch. Codice articolo 9781441909831
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RF and Microwave Microelectronics Packaging
Da: AHA-BUCH GmbH, Einbeck, Germania
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Codice articolo 9781441909831
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RF and Microwave Microelectronics Packaging
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RF and Microwave Microelectronics Packaging
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
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Condizione: New. Codice articolo ABLIING23Mar2411530293447
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