RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:
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Destinazione, tempi e costiDa: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut - Gepflegter, sauberer Zustand. | Seiten: 285 | Sprache: Englisch | Produktart: Bücher. Codice articolo 5460110/2
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Da: moluna, Greven, Germania
Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents methods and techniques used for measuring and testing of the electronic materials propertiesPresents an in-depth discussion of ceramic materials for RF/MW packagingPresents numerical simulation methods and techniques used in analys. Codice articolo 4172151
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Da: Brook Bookstore On Demand, Napoli, NA, Italia
Condizione: new. Questo è un articolo print on demand. Codice articolo c4e5b81f64c355179456813fda6531c6
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 285 pp. Englisch. Codice articolo 9781441909831
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Da: AHA-BUCH GmbH, Einbeck, Germania
Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Codice articolo 9781441909831
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Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9781441909831_new
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Condizione: New. Codice articolo ABLIING23Mar2411530293447
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