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Vlsi-soc - from Systems to Chips: Ifip Tc 10/Wg 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (Vlsi-soc 2003), December 1-3, 2003, Darmstadt, Germany - Brossura

 
9781441941268: Vlsi-soc - from Systems to Chips: Ifip Tc 10/Wg 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (Vlsi-soc 2003), December 1-3, 2003, Darmstadt, Germany
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This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.

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Contenuti:
Effect of Power Optimizations on Soft Error Rate.- Dynamic Models for Substrate Coupling in Mixed-Mode Systems.- Hinoc: A Hierarchical Generic Approach for on-Chip Communication, Testing and Debugging of SoCs.- Automated Conversion of SystemC Fixed-Point Data Types.- Exploration of Sequential Depth by Evolutionary Algorithms.- Validation of Asynchronous Circuit Specifications Using IF/CADP.- On-Chip Property Verification Using Assertion Processors.- Run-Time FPGA Reconfiguration for Power-/Cost-Optimized Real-time Systems.- A Switched Opamp Based 10 Bits Integrated ADC for Ultra Low Power Applications.- Exploring the Capabilities of Reconfigurable Hardware for OFDM-Based Wlans.- Software-Based Test for Nonprogrammable Cores in Bus-Based System-On-Chip Architectures.- Optimizing SOC Test Resources Using Dual Sequences.- A Novel full Automatic Layout Generation Strategy for Static CMOS Circuits.- Low Power Java Processor for Embedded Applications.- Impact of Gate Leakage on Efficiency of Circuit Block Switch-Off Schemes.- Evaluation Methodology for Single Electron Encoded Threshold Logic Gates.- Asynchronous Integration of Coarse-Grained Reconfigurable XPP-Arrays Into Pipelined Risc Processor Datapath.- Gray Encoded Arithmetic Operators Applied to FFT and FIR Dedicated Datapaths.- Stuck-At-Fault Testability of SPP Three-Level Logic Forms.
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International Federation for Information Processing

The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.

For more information about the 300 other books in the IFIP series, please visit www.springeronline.com.

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  • EditoreSpringer Verlag
  • Data di pubblicazione2009
  • ISBN 10 1441941266
  • ISBN 13 9781441941268
  • RilegaturaCopertina flessibile
  • Numero di pagine326

Altre edizioni note dello stesso titolo

9780387334028: Vlsi-soc: From Systems to Chips: Ifip Tc 10/Wg 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip, Vlsi-soc 2003, December 1-3, 2003, Darmstadt, Germany

Edizione in evidenza

ISBN 10:  0387334025 ISBN 13:  9780387334028
Casa editrice: Springer-Verlag New York Inc, 2006
Rilegato

  • 9780387513256: VLSI-Soc: From Systems to Chips

    Springer, 2008
    Brossura

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Descrizione libro Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12\* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book. 328 pp. Englisch. Codice articolo 9781441941268

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Descrizione libro Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Most up-to-date research on microelectronics designThis book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, . Codice articolo 4174483

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Descrizione libro Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12\* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book. Codice articolo 9781441941268

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