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Descrizione libro Soft Cover. Condizione: new. Codice articolo 9781461346326
Descrizione libro Condizione: New. Codice articolo ABLIING23Mar2716030031426
Descrizione libro Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. Codice articolo ria9781461346326_lsuk
Descrizione libro Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology. 328 pp. Englisch. Codice articolo 9781461346326
Descrizione libro Paperback / softback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days. Codice articolo C9781461346326
Descrizione libro Condizione: New. Codice articolo 4192886
Descrizione libro Condizione: New. pp. 328. Codice articolo 26127779862
Descrizione libro Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology. Codice articolo 9781461346326
Descrizione libro Paperback. Condizione: Brand New. reprint edition. 320 pages. 9.25x6.10x0.74 inches. In Stock. Codice articolo x-1461346320
Descrizione libro Condizione: New. Print on Demand pp. 328 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam. Codice articolo 132807625