Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development - Brossura

Way Kuo, .; Wei-Ting Kary Chien; Taeho Kim

Brossura

ISBN 10: 1461375967 ISBN 13: 9781461375968

Casa editrice: Springer, 2014

Riassunto

The international market is very competitive for high-tech manufacturers to­ day. Achieving competitive quality and reliability for products requires leader­ ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de­ sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur­ ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: the economic impact of employing the microelectronics fabricated by in­ dustry, a study of the relationship between reliability and yield, the progression toward miniaturization and higher reliability, and the correctness and complexity of new system designs, which include a very significant portion of software.

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Contenuti

Preface. 1. Overview of Design, Manufacture, and Reliability. 2. Integrating Reliability into Microelectronics Manufacturing. 3. Basic Reliability Concept. 4. Yield and Modeling Yield. 5. Reliability Stress Tests. 6. Burn-In Performance, Cost, and Statistical Analysis. 7. Nonparametric Reliability Analysis. 8. Parametric Approaches to Decide Optimal System Burn-In Time. 9. Nonparametric Approach and Its Applications to Burn-In. 10. Nonparametric Bayesian Approach for Optimal Burn-In. 11. The Dirichlet Process for Reliability Analysis. 12. Software Reliability and Infant Mortality Period of the Bathtub Curve. Epilogue: Cost-Effective Design for Stress Burn-In. References. Appendices: A. Notation and Nomenclature. B. Failure Modes for Parts. C. Common Probability Distributions. D. Simulation for U-Shaped Hazard Rate Curves. E. Sample Programs. Index.

Dettagli dell'edizione

• Editore: Springer
• Data di pubblicazione: 2014
• Lingua: Inglese
• ISBN 10: 1461375967
• ISBN 13: 9781461375968
• Rilegatura: Copertina flessibile
• Numero di pagine: 424
• Contatto del produttore: non disponibile
• Persona responsabile: non disponibile