Packaging of High Power Semiconductor Lasers - Rilegato

Liu, Xingsheng; Zhao, Wei; Xiong, Lingling; Liu, Hui

Rilegato

ISBN 10: 1461492629 ISBN 13: 9781461492627

Casa editrice: Springer Nature, 2014

Riassunto

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Su questo libro

L'autore:

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Contenuti:

Introduction of High Power Semiconductor Lasers.- Package Types of High Power Semiconductor Lasers.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress Failures: Prediction and Prevention.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Processes in Packaging of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Reliability Assessment and Failure Analysis in High Power Semiconductor Lasers.- Technology Trend and Challenges in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.

Su questa edizione

• Editore: Springer Nature
• Data di pubblicazione: 2014
• ISBN 10: 1461492629
• ISBN 13: 9781461492627
• Rilegatura: Copertina rigida
• Numero di pagine: 402