Interconnects in VLSI Design - Brossura

Brossura

ISBN 10: 1461543509 ISBN 13: 9781461543503

Casa editrice: Springer, 2011

Riassunto

Foreword; H. Grabinski. Recent Development in Interconnect Modeling; J.M. Wang, E.S. Kuh. Study of Parallel Plane Mode Excitation at a Double-Layer Via Interconnect Using the FDTD Method; C. Schuster, W. Fichtner. A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology; T. Steinecke. Measurement of Signal Integrity within Deep-Submicron Interconnect; F. Caignet, et al. Considering Magnetic Interference in Board-Level Interconnect Design; G. Müller, K. Reiß. Input Shape Influence over Interconnect Performances; L.B. Kenmei, et al. Comparison of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations; S. Hasan, et al. Black-Box Modeling of Digital Devices; I.S. Stievano, et al. Advanced Modeling of Nonuniform Interconnects; S. Grivet-Talocia, et al. Modeling of Passive Components for Radio Frequency Applications; J. Lescot, et al. Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards; A. Madou, L. Martens. Characteristic Impendance Measurement on Silicon; U. Arz, et al. Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects; M. Grimm, et al. Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems; A. Wallrabenstein, et al. Quantifying the Impact of Optical Interconnect Latency on the Performance of Optoelectronic FPGA's; J. Dambre, et al. PIN CMOS Receivers for Optical Interconnects; H. Zimmermann, et al. BICMOS Receiver OEIC for Optical Interconnect; K. Kieschnick, et al. Electrical/Optical Circuit Boards: Technology - Design - Modeling; E. Griese, et al.

Dettagli dell?edizione

• Editore: Springer
• Data di pubblicazione: 2011
• Lingua: Inglese
• ISBN 10: 1461543509
• ISBN 13: 9781461543503
• Rilegatura: Paperback
• Contatto del produttore: non disponibile
• Persona responsabile: non disponibile