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EXPERIMENTAL AND COMPUTATIONAL HEAT TRANSFER ANALYSIS OF MICRO-CHANNEL HEAT SINK WITH DIFFERENT MANIFOLD ARRANGEMENTS - Brossura

 
9781723799006: EXPERIMENTAL AND COMPUTATIONAL HEAT TRANSFER ANALYSIS OF MICRO-CHANNEL HEAT SINK WITH DIFFERENT MANIFOLD ARRANGEMENTS

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Heat sink is an object, system or an environment that absorbs or dissipates heat from anotherusing direct or radiant thermal contact. Heat sink is object that enhances heat dissipation fromcomponent to a cooler ambient. The primary purpose of a heat sink is to maintain the temperatureof the device being cooled within acceptable limits as specified by the component manufacturer.Heat sinks are normally made up of copper or aluminum and is in directly contact with microchipson a circuit board.This advancement leads to the development of miniaturized systems, which further leads tovarious applications, as in the field of medical science, electronic and bioengineering. These typesof systems often contain small scale fluid channels embedded in the surrounding solids withheating sourcesStudy have been done on the different shapes of manifolds through the project. In this workdifferent watts (50, 75, 100 and 125 W) are used with Reynolds number ranging from 342 to857.Due to the instability of flow at the entrance and exit regions of the micro channels, it is thebasic needs to come up with an efficient design of inlet and outlet manifold shapes and with anefficient design of micro-channels.The overall performance of micro channel heat sink (MCHS) as a system is affected by the inletand outlet manifold arrangements in addition to array of micro channel. In the present study theexperimental analysis is performed w.r.t the heat transfer coefficient, pressure drop and Nusseltnumber for three different manifold arrangements. In the experiment deionized water is made toflow through the inlet manifolds to the array of micro channels and exit is through outletmanifolds. In the present work three different arrangements: Rectangular (R), Rectangle withsemi-circular (RSC) and Divergent Convergent (DC) of the inlet and outlet manifolds areselected. Within the Reynolds number range 342-857 DC type manifold has highest heat transfercoefficient of about 24%-32% in comparison to Rectangle (R) type manifold while Rectanglewith semi-circle (RSC) shows an enhancement of about 7% to 10% as compare to Rectangular(R).

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  • EditoreIndependently published
  • Data di pubblicazione2018
  • ISBN 10 1723799009
  • ISBN 13 9781723799006
  • RilegaturaCopertina flessibile
  • LinguaInglese
  • Numero di pagine69
  • Contatto del produttorenon disponibile

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Anurag Dahiya, Harpreet Singh & Dr. S.S. Sehgal .
Editore: Independently published, 2018
ISBN 10: 1723799009 ISBN 13: 9781723799006
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