Descrizione libro Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. 348 pp. Englisch. Codice articolo 9783662521359

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Photonic Packaging Sourcebook

Ulrich H. P. Fischer-Hirchert

Editore: Springer Berlin Heidelberg (2016)

ISBN 10: 3662521350 ISBN 13: 9783662521359

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moluna
(Greven, Germania)

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Descrizione libro Condizione: New. Codice articolo 449138478

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Photonic Packaging Sourcebook : Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

Ulrich H. P. Fischer-Hirchert

Editore: Springer Berlin Heidelberg (2016)

ISBN 10: 3662521350 ISBN 13: 9783662521359

Nuovo Taschenbuch Quantit�: 1

Da:

AHA-BUCH GmbH
(Einbeck, Germania)

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Descrizione libro Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. Codice articolo 9783662521359

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