Foto dell'editore

Bonding in Microsystem Technology

Jan A. Dziuban

Editore: Springer-Verlag Gmbh Jun 2006, 2006
ISBN 10: 1402045786 / ISBN 13: 9781402045783
Nuovi / Buch / Quantità: 1
Da Rhein-Team Lörrach Ivano Narducci e.K. (Lörrach, Germania)
Copie del libro da altre librerie
Mostra tutte le  copie di questo libro
Aggiungere al carrello
Prezzo consigliato:
Prezzo: EUR 234,33
Convertire valuta
Spedizione: EUR 12,00
Da: Germania a: U.S.A.
Destinazione, tempi e costi

Lista dei preferiti

Libro

Dati bibliografici


Titolo: Bonding in Microsystem Technology

Casa editrice: Springer-Verlag Gmbh Jun 2006

Data di pubblicazione: 2006

Legatura: Buch

Condizione libro: Neu

Descrizione:

Neuware - Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique. Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author s personal experience. Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources. This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. 331 pp. Englisch. Codice inventario libreria 9781402045783

Su questo libro:

Book ratings provided by GoodReads):
0 valutazione media
(0 valutazioni)

Riassunto: This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Info su libreria e pagamento

Metodi di pagamento

La libreria accetta i seguenti metodi di pagamento:

  • American Express
  • Assegno
  • Carte Bleue
  • Mastercard
  • PayPal
  • Visa

[Cercare nel catalogo della libreria]

[Tutti i libri della libreria]

[Fare una domanda alla libreria]

Libreria: Rhein-Team Lörrach Ivano Narducci e.K.
Indirizzo: Lörrach, Germania

Libreria AbeBooks dal: 11 gennaio 2012
Valutazione libreria: 5 stelle

Condizioni di vendita:

Allgemeine Geschäftsbedingungen (abebooks.de)

Rhein-Team Lörrach, Inhaber Ivano Narducci e.K., Mühlestr. 1
D-79539 Lörrach, nachfolgend als Verkäufer bezeichnet.

§ 1 Allgemeines, Begriffsbestimmungen

(1) Der Verkäufer bietet unter dem Nutzernamen rhein-team unter der Plattform abebooks.de insbesondere Bücher an. Die folgenden Allgemeinen Geschäftsbedingungen (AGB) gelten für die Geschäftsbeziehung zwischen dem Verkäufer und dem Kunden in ihrer zum Zeitpunkt der Bestellung gültigen Fassung. Ferne...

[Ulteriori informazioni]

Condizioni di spedizione:

Die Ware wird innerhalb von 1-3 Tagen nach Bestelleingang verschickt. Bitte entnehmen Sie den voraussichtlichen Liefertermin Ihrer Bestellbestätigung. Die Versandkostenpauschalen basieren auf Durchschnittswerten für 1 kg schwere Bücher. Über abweichende Kosten (z.B. wegen eines sehr schweren Buches) werden Sie gegebenenfalls vom Verkäufer informiert.


Informazioni dettagliate sul venditore