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Handbook of Silicon Wafer Cleaning Technology, 2nd Edition, Second Edition (Materials Science and Process Technology)

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ISBN 10: 0815515545 / ISBN 13: 9780815515548
Editore: William Andrew, 2008
Usato Condizione Used Hardcover
Da Book Deals (Lewiston, NY, U.S.A.) Quantità: 1
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This Book is in Good Condition. Clean Copy With Light Amount of Wear. 100% Guaranteed. Summary: Part 1: Introduction and Overview Overview and Evolution of Silicon Wafer Cleaning Technology Overview of Wafer Contamination and Defectivity Part 2: Wet-Chemical Processes Particle Deposition and Adhesion Aqueous Cleaning and Surface Conditioning Processes Part 3: Dry Cleaning Processes Gas-phase Wafer Cleaning Technology Plasma Stripping and Cleaning Cryogenic Aerosols and Supercritical Fluid Cleaning Part 4: Analytical and Control Aspects Detection and Measurement of Particulate Contaminants Surface Chemical Composition and Morphology Ultratrace Impurity and Surface Morphology Analysis Analysis and Control of Electrically Active Contaminants Part 5: Directions for the Near Future. Codice inventario libreria ABE_book_usedgood_0815515545

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The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.

. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits.
. As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries.
. Covers processes and equipment, as well as new materials and changes required for the surface conditioning process.
. Editors are two of the top names in the field and are both extensively published.
. Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol.

L'autore: Karen A. Reinhardt is Principle Consultant at Cameo Consulting in San Jose, California. Currently, Karen works with start-up cleaning companies to develop their technology for acquisition. Prior to forming a consulting company, Karen was employed at Novellus Systems, in this role she was responsible for investigating new cleaning technologies that allows realization of the ITRS roadmap with respect to smaller geometries, new materials, and the environmental issues associated with current processes. Karen also worked at AMD and Cypress Semiconductor as a process development engineer. Karen has published over 30 technical papers on plasma processing, damage characterization and cleaning technology assessment. She has been awarded seven patents. Karen is currently co-leading the ITRS Surface Prep Technical Working Group. Werner Kern is president of Werner Kern Associates, a consulting firm for Semiconductor Materials Processing. From 1959-1987, he was a scientist at the RCA David Sarnoff Research Center in Princeton, New Jersey as a Fellow of the Technical Staff. While at RCA he developed the RCA Standard Clean Process for silicon wafer cleaning, which in its various forms is still used worldwide after nearly 40 years. In 1988 he joined Lam Research Corporation as a Senior Scientist and currently opened his own consulting company.



Werner Kern is the holder of 11 US Patents and is the author and co-author of over 150 scientific publications. He is the editor of four technical books, is an Emeritus Fellow of the Electrochemical Society, and an Emeritus Member of the American Vacuum Society. He is the recipient of three RCA Outstanding Achievement Awards and the Callinan Award from the Electrochemical Society’s Dielectric Science Division. Several additional awards include a NASA Recognition in 1981, the prestigious 1997 SEMI Award for his lifetime contributions to the semiconductor industry, and the SCP Global Technologies’ Inc. the Werner Kern Award, which was founded in his honor for technical excellence in 1999.

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Titolo: Handbook of Silicon Wafer Cleaning ...

Casa editrice: William Andrew

Data di pubblicazione: 2008

Legatura: Hardcover

Condizione libro: Used

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