Bonding in Microsystem Technology: 24 - Rilegato

Dziuban, J. A.

Rilegato

ISBN 10: 1402045786 ISBN 13: 9781402045783

Casa editrice: Springer Verlag, 2006

Riassunto

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

Su questo libro

Recensione:

From the reviews:

"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. ... Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)

Contenuti:

Acknowledgments. List of Acronyms and Symbols. 1. Introduction. 2. Some remarks on microsystem systematic and development. 2.1 Literature 3. Deep three-dimensional silicon micromachining. 3.1 Micromechanical substrates and mechanical properties of silicon. 3.2 Wet anisotropic etching of silicon. 3.3 Basic micromechanical constructions. 3.4 Literature 4. Bonding. 4.1 Surface cleaning and activation. 4.2 High temperature fusion bonding. 4.3 Low temperature bonding. 4.4 Anodic (electrostatic) bonding. 4.5 Literature 5. Classification of bonding and closing remarks. 5.1 Literature

Su questa edizione

• Editore: Springer Verlag
• Data di pubblicazione: 2006
• ISBN 10: 1402045786
• ISBN 13: 9781402045783
• Rilegatura: Copertina rigida
• Numero di pagine: 331