Integrated Interconnect Technologies for 3D Nanoelectronic Systems - Rilegato

Rilegato

ISBN 10: 1596932465 ISBN 13: 9781596932463

Casa editrice: Artech House, 2008

Riassunto

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.

Su questo libro

L'autore:

Muhanned S. Bakir is a research engineer at the Microelectronics Research Center and adjunct professor in the School of Electrical and Computer Engineering at Georgia Institute of Technology. James D. Meindl is the director of the Joseph M. Pettit Microelectronics Research Center and is the founding director of the Nanotechnology Research Center at Georgia Institute of Technology, where he is also the Joseph M. Pettit Chair Professor of Microsystems.

Product Description:

Book by None

Su questa edizione

• Editore: Artech House
• Data di pubblicazione: 2008
• ISBN 10: 1596932465
• ISBN 13: 9781596932463
• Rilegatura: Copertina rigida
• Numero edizione: 1
• Numero di pagine: 528
• Redattore: Bakir Muhannad S., Meindl James D.