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Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Basi6 International, Irving, TX, U.S.A.
Libro
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Libro
Condizione: New. Brand New Original US Edition.We Ship to PO BOX Address also. EXPEDITED shipping option also available for faster delivery.This item may ship from the US or other locations in India depending on your location and availability.
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: SMASS Sellers, IRVING, TX, U.S.A.
Libro
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed. This item may ship from the US or our Overseas warehouse depending on your location and stock availability. We Ship to PO BOX Location also.
Editore: Springer, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: booksXpress, Bayonne, NJ, U.S.A.
Libro
Soft Cover. Condizione: new.
Editore: Springer, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Libro
Condizione: New.
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Libro
Condizione: New.
Editore: Springer, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: Ria Christie Collections, Uxbridge, Regno Unito
Libro Print on Demand
Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Ria Christie Collections, Uxbridge, Regno Unito
Libro Print on Demand
Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Editore: Springer Netherlands Nov 2010, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Libro Print on Demand
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique. Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author s personal experience. Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources. 352 pp. Englisch.
Editore: Springer Netherlands, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: moluna, Greven, Germania
Libro Print on Demand
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technologyDetailed description and working receipts (know-how) of KOH etching and .
Editore: Springer Netherlands, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: AHA-BUCH GmbH, Einbeck, Germania
Libro
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique. Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author s personal experience. Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources.
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Books Puddle, New York, NY, U.S.A.
Libro
Condizione: Used. pp. 352.
Editore: Springer, 2006
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: Revaluation Books, Exeter, Regno Unito
Libro
Paperback. Condizione: Brand New. 349 pages. 9.00x6.00x0.83 inches. In Stock.
Editore: Springer Netherlands, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: moluna, Greven, Germania
Libro
Gebunden. Condizione: New. The first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technologyDetailed description and working receipts (know-how) of KOH etching and .
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Majestic Books, Hounslow, Regno Unito
Libro
Condizione: Used. pp. 352 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Editore: Springer, 2010
ISBN 10: 9048171512ISBN 13: 9789048171514
Da: Mispah books, Redhill, SURRE, Regno Unito
Libro
Paperback. Condizione: Like New. Like New. book.
Editore: Springer, 2006
ISBN 10: 1402045786ISBN 13: 9781402045783
Da: Mispah books, Redhill, SURRE, Regno Unito
Libro
Hardcover. Condizione: Like New. Like New. book.