Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Paperback. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Condizione: good. A well-loved companion. Corners and cover might show a little wear, and you could find some notes or highlights. The dust jacket might be MIA, it might have been a library book and extras aren't guaranteedâ"but the story's all there!
Lingua: Inglese
Editore: Pearson Education, Limited, 2000
ISBN 10: 0201618605 ISBN 13: 9780201618600
Da: Better World Books: West, Reno, NV, U.S.A.
Condizione: Good. Used book that is in clean, average condition without any missing pages.
Lingua: Inglese
Editore: Pearson Education, Limited, 2000
ISBN 10: 0201618605 ISBN 13: 9780201618600
Da: Better World Books, Mishawaka, IN, U.S.A.
Condizione: Good. Used book that is in clean, average condition without any missing pages.
Lingua: Inglese
Editore: Van Nostrand Reinhold, New York, 1993
ISBN 10: 0442012365 ISBN 13: 9780442012366
Da: Book Booth, Berea, OH, U.S.A.
Hardcover. Condizione: Very Good. Pages clean & bright; binding tight; very minor wear to covers. 875 pages. Illustrated. "Emphasizing MCM fundamentals and reporting real MCM experiences, this book is intended for those who need a broad exposure to the concepts underlying the design, fabrication, packaging, assembly and manufacture of multichip modules." Size: 6" x 9".
Paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Paperback. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Condizione: acceptable. Fairly worn, but readable and intact. If applicable: Dust jacket, disc or access code may not be included.
hardcover. Condizione: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST!
Da: Reader's Corner, Inc., Raleigh, NC, U.S.A.
Prima edizione
Hardcover. Condizione: Fine. No Jacket. 1st Edition. This is a fine hardcover first edition, first printing copy, no DJ, white/black spine, 314 pages with index.
Lingua: Inglese
Editore: World Scientific Publishing Company, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Da: La bataille des livres, Pradinas, Francia
EUR 13,76
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+].
Da: Bibliomadness, Worthington, MA, U.S.A.
Prima edizione
Hardcover. Condizione: Good. 1st Edition. Note older edition, copyright 2001. Good condition. Some edgewear. Used and bookstore stickers on spine and rear cover. A handful of pages with some pencil markings. All intact. Good reading or reference copy.
Condizione: New. Satisfaction Guaranteed or your money back.
Da: BennettBooksLtd, San Diego, NV, U.S.A.
paperback. Condizione: New. In shrink wrap. Looks like an interesting title!
Lingua: Inglese
Editore: World Scientific Pub Co Inc, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 150,14
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like NewLIKE NEW. book.
Da: DeckleEdge LLC, Albuquerque, NM, U.S.A.
paperback. Condizione: new.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Condizione: New.
Lingua: Inglese
Editore: World Scientific Publishing Company, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Da: Aragon Books Canada, OTTAWA, ON, Canada
EUR 212,47
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
EUR 238,59
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 280,19
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.