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Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: Very Good. No Jacket. Missing dust jacket; May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.75.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Paperback. Condizione: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.
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Product Reliability, Maintainability, and Supportability Handbook
Da: Crossroad Books, Eau Claire, WI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: with no dust jacket. Condizione sovraccoperta: No Dust Jacket. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22B; 413 pages; Ex-Library.
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach (Electronic Packaging)
Libro 4 di 4: Electronic PackagingDa: Budget Books, Pasadena, CA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Hardcover. Condizione: Fair. No Jacket. 1st Edition. This book is seriously flawed by the fact that pages 289 to 307 function as an insert. They are completely separated from the binding. But the book is all there and is otherwise in new condition. There are no tears or signs of wear to the clean pages or the cover.
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Guidebook for Managing Silicon Chip Reliability
Libro 2 di 4: Electronic PackagingDa: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: As New. Unread book in perfect condition.
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Placement and Routing of Electronic Modules (Electrical and Computer Engineering)
Libro 46 di 55: Electrical and Computer EngineeringDa: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.
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Risk-Based Engineering: An Integrated Approach to Complex Systems?Special Reference to Nuclear Plants (Springer Series in Reliability Engineering)
Libro 60 di 90: Springer Series in Reliability EngineeringDa: Twice Sold Tales, Seattle, WA, U.S.A.
Valutazione del venditore 1 su 5 stelle
Hardcover. Condizione: Good. The book is in good condition with a clean interior; the cover contain minor bumps and scratches along the spine and edges. Book.
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Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series)
Libro 2 di 4: Electronic PackagingDa: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: acceptable. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Acceptable condition! Any other included accessories are also in Acceptable condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear such as cover tears discoloration, staining, marks, scuffs, etc. All pages intact.
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Singapore and Malaysia Electronics Industries
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 16,54
EUR 7,45 shipping
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 128.
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Hardcover. Condizione: Very Good. Condizione sovraccoperta: No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.
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Fröhliche Weihnacht überall - Die schönsten Weihnachtslieder mit Noten
Da: Antiquariat Fuchseck - ab 1.1.2026 ohne Umsatzsteuer (§ 19 UStG), Gammelshausen, Germania
Valutazione del venditore 5 su 5 stelle
EUR 4,95
EUR 14,95 shipping
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Gut. Angelika Pecht: (illustratore). o.J. (22 Seiten).
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Paperback. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 176 1st Edition.
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EUR 6,99
EUR 20,50 shipping
Spedito da Francia a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Très bon. Ancien livre de bibliothèque. Edition 1996. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Edition 1996. Ammareal gives back up to 15% of this item's net price to charity organizations.
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Singapore and Malaysia Electronics Industries
Da: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 18,06
EUR 9,95 shipping
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 128.
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The Korean Electronics Industry
Libro 3 di 3: The Electronics Industry Research SeriesDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 144 1st Edition.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Da: K & L KICKIN' BOOKS, Corinth, TX, U.S.A.
Valutazione del venditore 4 su 5 stelle
Prima edizione
Hardcover. Condizione sovraccoperta: no dust jacket. First Edition. Very good with slight shelf wear.
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Plasticâ"Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Da: WeBuyBooks, Rossendale, LANCS, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 19,91
EUR 9,97 shipping
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. Ex library copy with usual stamps & stickers.
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The Korean Electronics Industry
Libro 3 di 3: The Electronics Industry Research SeriesDa: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 21,93
EUR 9,95 shipping
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 144.
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Electronics Industry in Taiwan
Libro 2 di 3: The Electronics Industry Research SeriesDa: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 22,90
EUR 9,95 shipping
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 176.
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Guidebook for Managing Silicon Chip Reliability. (=Electronic Packaging Series).
Lingua: Inglese
Editore: Taylor & Francis Inc., 1998
Da: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, Germania
Membro dell'associazione: GIAQ
Valutazione del venditore 5 su 5 stelle
EUR 8,60
EUR 25,00 shipping
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.
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Singapore and Malaysia Electronics Industries
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 128 1st Edition.
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Plastic-Encapsulated Microelectronics: Materials, Processes, Quality, Reliability, and Applications
Da: Florida Mountain Book Co., Datil, NM, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Very Good. Hardcover, [xxxiv], 474 pages. Very Good condition/no dust jacket. Ex-library. Size 9.5"x6.5". "For the first time between two covers, here is a comprehensive, critical review of the state of the art in PEMs and assemblies that incorporate them. The most timely book on the subject, it provides professionals with a systematic, scientific exploration of crucial technical and reliability issues concerning the manufacture and use of PEMs - with special attention focusing on environment-specific applications." Library stamp on front pastedown & title page, previous owner's name on front & rear pastedowns, else Near Fine condition, clean and unmarked.
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Engineering for Social Change
Da: -OnTimeBooks-, Phoenix, AZ, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach (Electronic Packaging Series)
Libro 4 di 4: Electronic PackagingDa: Dorley House Books, Inc., Hagerstown, MD, U.S.A.
Valutazione del venditore 4 su 5 stelle
Prima edizione
Hardcover. Condizione: Near Fine. B/W Photos; Diagrams, Etc (illustratore). 1st. 1st printing; glossy pictorial c; 307 clean, unmarked pages.
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The Korean Electronics Industry
Libro 3 di 3: The Electronics Industry Research SeriesDa: Greenworld Books, Arlington, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: good. Fast Free Shipping â" Good condition book with a firm cover and clean, readable pages. Shows normal use, including some light wear or limited notes highlighting, yet remains a dependable copy overall. Supplemental items like CDs or access codes may not be included.
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Hardcover. Condizione: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority!
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Hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Placement and Routing of Electronic Modules
Libro 46 di 55: Electrical and Computer EngineeringDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 352.
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hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
