Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Editore: Springer
ISBN 10: 8120090004 ISBN 13: 9788120090002
Da: Books in my Basket, New Delhi, India
EUR 15,27
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New. ISBN: 9783211728604.
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Da: ALLBOOKS1, Direk, SA, Australia
EUR 52,49
Quantità: 1 disponibili
Aggiungi al carrelloBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
Da: GreatBookPrices, Columbia, MD, U.S.A.
Condizione: New.
Lingua: Inglese
Editore: Springer Verlag GmbH, Vienna, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condizione: new. Paperback. As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 51,65
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Basi6 International, Irving, TX, U.S.A.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
EUR 58,07
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Condizione: New.
Lingua: Inglese
Editore: Springer Verlag GmbH, Vienna, 2012
ISBN 10: 3709173728 ISBN 13: 9783709173725
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condizione: new. Paperback. The "Fifth International Conference on Simulation of Semiconductor Devices and Processes" (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in the area of numerical process and de vice simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconduc tor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Condizione: As New. Unread book in perfect condition.
Da: ALLBOOKS1, Direk, SA, Australia
EUR 68,05
Quantità: 8 disponibili
Aggiungi al carrelloBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 58,48
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 58,48
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Lingua: Inglese
Editore: Wien, Society for Micro- and Nanoelectronics - TU Wien,, 2012
ISBN 10: 3901578250 ISBN 13: 9783901578250
Da: COTTAGE Antiquariat - anbu.at, Langenzersdorf, Austria
EUR 20,60
Quantità: 1 disponibili
Aggiungi al carrello4°, Original-Broschur. xiii, 84 Seiten. Einband berieben und mit Lagerspuren, innen tadellos. Ein offensichtlich ungelesenes, durchgehend sauberes Exemplar. In englischer Sprache. IS: 9783901578250 ****An unsere Kunden in Deutschland: Versand nach Deutschland einmal in der Woche ab Freilassing mit der Deutschen Post.*** - Sprache: Englisch Gewicht in Gramm: 550.
EUR 39,34
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 38,18
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 40,35
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
EUR 59,31
Quantità: 1 disponibili
Aggiungi al carrelloGood. UK stocked, available immediately. Hardcover, published by Springer in 1989. First edition. Very minor rubbing to the printed board covers, the front endpaper has been clipped. The text is unmarked throughout, a nice copy. Illustrated. Weight (unpacked) is 678 grams.
Condizione: New. pp. 532.
Da: Basi6 International, Irving, TX, U.S.A.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: UK BOOKS STORE, London, LONDO, Regno Unito
EUR 81,79
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-12 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Da: Revaluation Books, Exeter, Regno Unito
EUR 78,61
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Da: La bataille des livres, Pradinas, Francia
EUR 41,78
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Très bon. Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui pourront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. | Simulation of Semiconductor Devices and Processes: Volume 5 | Selberherr et alii | Springer-Verlag, 1993, in-8 cartonnage éditeur, 504 pages. Couverture propre. Dos solide. Intérieur frais. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage. Bel état ! [BT14+].
Da: ALLBOOKS1, Direk, SA, Australia
EUR 94,65
Quantità: 1 disponibili
Aggiungi al carrelloBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
EUR 82,25
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 524 pages. 9.50x6.75x1.00 inches. In Stock.