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Fundamentals of Microsystems Packaging
Da: St Vincent de Paul of Lane County, Eugene, OR, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Good. COVER SHOWS SOME GENERAL WEAR, SUCH AS SCRATCHES AND RUBBING. hardcover 100% of proceeds go to charity! Good condition with all pages in tact. Item shows signs of use and may have cosmetic defects.
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Fundamentals of Microsystems Packaging
Da: Goodwill Books, Hillsboro, OR, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: acceptable. Fairly worn, but readable and intact. If applicable: Dust jacket, disc or access code may not be included.
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Fundamentals of Microsystems Packaging
Da: The Maryland Book Bank, Baltimore, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
hardcover. Condizione: Very Good. 1st Edition. Used - Very Good.
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Fundamentals of Microsystems Packaging
Da: thebookforest.com, San Rafael, CA, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: Very Good. Text block firm and clean, binding unblemished, boards straight, without highlights or underlining. Without any discs, access codes or extra items. Supporting Bay Area Friends of the Library since 2010. Well packaged and promptly shipped.
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Fundamentals of Microsystems Packaging
Da: Textbooks_Source, Columbia, MO, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
Hardcover. Condizione: Good. 1st Edition. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Microelectronics Packaging HandBook
Lingua: Inglese
Editore: Van Nostrand Reinhold, New York NY, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Da: Longs Peak Book Company, Loveland, CO, U.S.A.
Valutazione del venditore 4 su 5 stelle
Prima edizione
Hardcover. Condizione: Near Fine. 1st Edition. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. This copy is in excellent condition, a second printing of the first edition, a hardback with no dustjacket . Given the book's size and weight--3# 13oz-- shipping charges will be adjusted.The book will be carefully wrapped and boxed for safe shipping.
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Microelectronics Packaging Handbook
Da: BookDepart, Shepherdstown, WV, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: UsedVeryGood. Hardcover; light fading, light shelf wear to exterior; otherwise in very good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear.
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Fundamentals of Microsystems Packaging
Da: Recycle Bookstore, San Jose, CA, U.S.A.
Valutazione del venditore 4 su 5 stelle
Hardcover. Condizione: Very Good. Book has mild rubbing to covers, mild wear to outer corners, a small gap between top area binding and spine cover, small folds to bottom corner of a grouping of pages. otherwise in very good condition, strong binding, clean and unmarked pages; some cosmetic wear but an overall sturdy copy with sharp text/diagrams.
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Microelectronics Packaging Handbook Vol. 2 : Semiconductor Packaging
Da: Better World Books: West, Reno, NV, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Decision Analysis with Business Applications
Lingua: Inglese
Editore: Intext Education Publishers, New York, 1973
ISBN 10: 0700224378 ISBN 13: 9780700224371
EUR 14,42
Spedizione EUR 54,32
Spedito da Canada a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHard Cover. Condizione: Fine. Previous Owner Markings (Name Neatly Inked to Front Free Endpaper); Spine, Boards Bumped; Light Shelf Rub to Boards; Spine Slightly Cocked; Edges Lightly Soiled; Slight Yellowing Due to Age. BOOK NUMBER: 022100. CONTENTS: Preface; Chapter 1. Analysis of Sets and Functions; Chapter 2. Fundamental Concepts of Probability Theory; Chapter 3. Random Variables and Probability Distributions; Chapter 4. Some Discrete Probability Distributions; Chapter 5. Some Continuous Probability Distributions; Chapter 6. Utility and Subjective Probability; Chapter 7. Structure of Decision Analysis Models; Chapter 8. Decision Analysis Under Certainty; Chapter 9. Decision Analysis Under Uncertainty When the Prior Probability Function is Not Known; Chapter 10. Single-Stage Decision Analysis; Chapter 11. Multistage Decision Analysis; Chapter 12. Decision Analysis with Sampling; Chapter 13. Decision Analysis with Sampling When Sample Observations are Discrete; Chapter 14. Decision Analysis with Sampling When Sample Observations are Continuous; Chapter 15. Decision Analysis Approach to Estimation Problems; Chapter 16. Decision Analysis Approach to Testing Hypothesis Problems; Chapter 17. Decision Analysis Approach to Regression Problems; Chapter 18. Conclusion; Appendix; Glossary; Answers to Selected Problems; Index. EXCERPT: Preface - . . . The text begins by developing the concepts of set theory and probability theory (Chapters 1 to 5). These concepts are then used to establish a classification of decision analysis models. The remainder of the book deals with the detailed development and analysis of decision and inference problems. For example, axiomatic development of utility and subjective probability is covered in Chapter 6. Decision analysis models under uncertainty, single-stage, multi-stage, game theory, and decision analysis with sampling are presented in Chapters 9 to 12. Even though the main objective of this textbook is to study decision problems under uncertainty, one chapter is allocated to decision problems under conditions of certainty, e.g., analysis of investment decisions and linear programming, in order to present, in a sense, the other side of the coin. In the concluding chapters certain well-known traditional techniques, such as estimation, hypothesis testing, and regression analysis, are studied from the point of view of the decision analysis approach . . . Size: 8vo - over 7¾" - 9¾" tall.
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Microelectronics Packaging Handbook, Vols. 1-3
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 1000 2nd Edition.
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Microelectronics Packaging Handbook, Vols. 1-3
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 50,57
Spedizione EUR 7,50
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 1000.
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Hard cover. Condizione: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
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Microelectronics Packaging Handbook, Vols. 1-3
Da: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 53,23
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 1000.
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Systems, Controls, Embedded Systems, Energy, and Machines (The Electrical Engineering Handbook)
Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
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Introduction to System-on-package Sop : Miniaturization of the Entire System
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.
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Condizione: good. Fast & Free Shipping â" Good condition with a solid cover and clean pages. Shows normal signs of use such as light wear or a few marks highlighting, but overall a well-maintained copy ready to enjoy. Supplemental items like CDs or access codes may not be included.
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System on Package: Miniaturization of the Entire System
Da: Textbooks_Source, Columbia, MO, U.S.A.
Valutazione del venditore 5 su 5 stelle
Prima edizione
hardcover. Condizione: Good. 1st Edition. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Condizione: new.
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Introduction to System-on-package Sop : Miniaturization of the Entire System
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 141,63
Spedizione EUR 2,21
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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System on Package: Miniaturization of the Entire System
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 140,48
Spedizione EUR 3,33
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Electronic Packaging for High Reliability : Low Cost Electronics
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New.
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Introduction to System-on-package Sop : Miniaturization of the Entire System
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
EUR 164,50
Spedizione EUR 2,21
Spedito in U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Electronic Packaging for High Reliability : Low Cost Electronics
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 160,77
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 159,51
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: As New. Unread book in perfect condition.
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Introduction to System-on-package Sop : Miniaturization of the Entire System
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 175,19
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Microelectronics Packaging Handbook : Subsystem Packaging
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 180,88
Spedizione EUR 17,31
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Systems, Controls, Embedded Systems, Energy, and Machines (The Electrical Engineering Handbook)
Da: Chiron Media, Wallingford, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 186,21
Spedizione EUR 17,87
Spedito da Regno Unito a U.S.A.Quantità: 5 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
