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Editore: Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: HPB-Red, Dallas, TX, U.S.A.
Libro
paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
Editore: Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: Ria Christie Collections, Uxbridge, Regno Unito
Libro Print on Demand
Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Editore: Springer 2010-10-29, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: Chiron Media, Wallingford, Regno Unito
Libro
Paperback. Condizione: New.
Editore: Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: booksXpress, Bayonne, NJ, U.S.A.
Libro
Soft Cover. Condizione: new.
Editore: Springer US Okt 2010, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Libro Print on Demand
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics. 324 pp. Englisch.
Editore: Springer-Verlag New York Inc., 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
Libro Print on Demand
Paperback / softback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Editore: Springer US, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: moluna, Greven, Germania
Libro Print on Demand
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Delivers the information designers need to implement the right packaging approach for their specific application Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost Focuses on how pa.
Editore: Springer US, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: AHA-BUCH GmbH, Einbeck, Germania
Libro
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.Integrated Circuit Packaging, Assembly and Interconnections is an introduction, a review and an update of packaging technologies.
Editore: Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Da: Mispah books, Redhill, SURRE, Regno Unito
Libro
Paperback. Condizione: Like New. Like New. book.