Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
EUR 14,90
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Aggiungi al carrelloHardcover. Condizione: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.55.
Da: Toscana Books, AUSTIN, TX, U.S.A.
EUR 37,59
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Aggiungi al carrelloHardcover. Condizione: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
EUR 50,47
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Da: Basi6 International, Irving, TX, U.S.A.
EUR 50,47
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: ALLBOOKS1, Direk, SA, Australia
EUR 60,22
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Da: Chiron Media, Wallingford, Regno Unito
EUR 45,87
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Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 63,29
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 63,88
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Da: Best Price, Torrance, CA, U.S.A.
EUR 71,11
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 61,43
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Da: Revaluation Books, Exeter, Regno Unito
EUR 53,12
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Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 671 pages. 10.00x6.75x2.25 inches. In Stock.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 72,31
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Da: Hay-on-Wye Booksellers, Hay-on-Wye, HEREF, Regno Unito
EUR 23,81
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Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 99,51
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Editore: Elsevier Science & Technology, William Andrew, 1991
ISBN 10: 0815512813 ISBN 13: 9780815512813
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 66,28
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Aggiungi al carrelloBuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.