key enabling technologies future (28 risultati)

Condizione: New.

Condizione: New. SUPER FAST SHIPPING.

Hardcover. Condizione: new. Hardcover. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging.As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability.The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on "Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications" at the European Microwave Week in Paris, France, on 22 September, 2024.Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future.The Open Access version of this book, available at , has been made available under a Creative Commons Attribution-Non Commercial (CC-BY-NC) 4.0 license. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Condizione: New.

Condizione: New.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New. In.

Condizione: New. SUPER FAST SHIPPING.

Condizione: New.

Condizione: New.

Hardcover. Condizione: new. Hardcover. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging.As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability.The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on "Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications" at the European Microwave Week in Paris, France, on 22 September, 2024.Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future.The Open Access version of this book, available at , has been made available under a Creative Commons Attribution-Non Commercial (CC-BY-NC) 4.0 license. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Paperback / softback. Condizione: New. New copy - Usually dispatched within 4 working days. 910.

Condizione: New.

Condizione: New. In.

Condizione: As New. Unread book in perfect condition.

Hardcover. Condizione: new. Hardcover. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging.As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability.The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on "Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications" at the European Microwave Week in Paris, France, on 22 September, 2024.Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future.The Open Access version of this book, available at , has been made available under a Creative Commons Attribution-Non Commercial (CC-BY-NC) 4.0 license. This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

Hardcover. Condizione: Brand New. 200 pages. 9.18x6.12x9.21 inches. In Stock.

Condizione: As New. Unread book in perfect condition.

Taschenbuch. Condizione: Neu. Neuware - Integrated Sensing and Communications for Future Wireless Networks: Principles, Advances and Key Enabling Technologies presents the principles, methods, and algorithms of ISAC, an overview of the essential enabling technologies, as well as the latest research and future directions. Suitable for academic researchers and post graduate students as well as industry R&D engineers, this book is the definitive reference in this interdisciplinary field that is being seen as a technology to enable emerging applications such as vehicular networks, environmental monitoring, remote sensing, IoT, smart cities. Importantly, ISAC has been identified as an enabling technology for B5G/6G, and the next-generation Wi-Fi system. ISAC brings together a range of technologies: radar sensing, reconfigurable intelligent surfaces, holographic surfaces through to high frequency terahertz, PHY security, channel signaling, multiple access, and machine learning.

Condizione: new. Questo è un articolo print on demand.

Paperback. Condizione: Brand New. 375 pages. 7.52x1.01x9.25 inches. In Stock. This item is printed on demand.

Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands.