Da: Studibuch, Stuttgart, Germania
EUR 8,79
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrellohardcover. Condizione: Gut. 501 Seiten; 9783211827369.3 Gewicht in Gramm: 2.
EUR 48,74
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 53,49
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - SISDEP '95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 62,39
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 67,23
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Chiron Media, Wallingford, Regno Unito
EUR 59,66
Convertire valutaQuantità: 10 disponibili
Aggiungi al carrelloPaperback. Condizione: New.
EUR 85,56
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 520.
EUR 85,19
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 520 pages. 9.61x6.69x1.18 inches. In Stock.
Editore: Springer Vienna, Springer Vienna Okt 2012, 2012
ISBN 10: 3709173639 ISBN 13: 9783709173633
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 85,55
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Neuware -SISDEP ¿95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 520 pp. Englisch.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 96,88
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
EUR 112,81
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. SISDEP 95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced proc.
EUR 63,60
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 103,13
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: Revaluation Books, Exeter, Regno Unito
EUR 148,01
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 516 pages. 9.61x6.69x1.13 inches. In Stock.
Da: Majestic Books, Hounslow, Regno Unito
EUR 86,54
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 520 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 88,13
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 520.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 85,55
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -SISDEP '95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software. 520 pp. Englisch.