Editore: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Lingua: Inglese
Da: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 248 | Sprache: Englisch | Produktart: Sonstiges.
Editore: Cham, Springer International Publishing., 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Lingua: Inglese
Da: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germania
EUR 18,00
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloAufl. 2015. XXI, 226 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Lecture Notes in Electrical Engineering ; 350. Sprache: Englisch.
Editore: Springer International Publishing, Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 106,99
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Editore: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 106,99
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.
Editore: Springer International Publishing, Springer International Publishing Okt 2016, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 106,99
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Editore: Springer International Publishing, Springer International Publishing Jul 2015, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 106,99
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 118,75
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 118,75
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: California Books, Miami, FL, U.S.A.
EUR 129,68
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Books Puddle, New York, NY, U.S.A.
EUR 138,85
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 226.
Da: Revaluation Books, Exeter, Regno Unito
EUR 153,86
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. reprint edition. 247 pages. 9.25x6.10x0.53 inches. In Stock.
Da: Revaluation Books, Exeter, Regno Unito
EUR 155,88
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Aggiungi al carrelloHardcover. Condizione: Brand New. 2015 edition. 250 pages. 9.25x6.25x0.75 inches. In Stock.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 104,52
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 104,86
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 166,65
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 166,65
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Editore: Springer International Publishing, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Lingua: Inglese
Da: moluna, Greven, Germania
EUR 92,27
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, .
Editore: Springer International Publishing, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Lingua: Inglese
Da: moluna, Greven, Germania
EUR 92,27
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, .
Editore: Springer International Publishing Okt 2016, 2016
ISBN 10: 3319386875 ISBN 13: 9783319386874
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 106,99
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. 248 pp. Englisch.
Editore: Springer International Publishing, Springer International Publishing Jul 2015, 2015
ISBN 10: 331919173X ISBN 13: 9783319191737
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 106,99
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D , to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. 248 pp. Englisch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 141,57
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 226.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 146,42
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 226.