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Aggiungi al carrelloPaperback or Softback. Condizione: New. Three-Dimensional Simulation of Semiconductor Devices 0.41. Book.
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Aggiungi al carrelloPaperback. Condizione: Brand New. reprint edition. 124 pages. German language. 9.02x5.99x0.40 inches. In Stock.
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The three-dimensional device simulation has become a necessary tool for the design and investigation of complex device structures. The evolution of the three-dimensional simulation tools is directly linked to the scaling of the devices and the increasing complex ity of dynamic random access memory (DRAM) cells. Scaling of MOSFET devices led to a three-dimensional geometry with effects which cannot be handled by two-dimensional simulations anymore. With increasing integration density in DRAMs the third dimen sion had to be utilized to realize the storage capacitor. The result ing leakage problems have to be investigated and the cell design optimized by means of three-dimensional simulations. This book is intended for senior undergraduate students in applied physics, electrical engineering and computational physics, as well as for scientists and engineers involved in semiconductor device re search and development. It is also intended for software engineers and all those who are concerned with simulation. The book will give an overview on the problems and activities con cerning three-dimensional device simulation, without the claim of being a classical textbook. It starts from the classical semiconduc tor equations, discusses the physical models used in device simu lation, describes the discretization and some numerical methods for solving the differential equations. The application of the three dimensional simulation to VLSI device engineering is illustrated by a few specific examples.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 39,01
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Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut - Gepflegter, sauberer Zustand.1991. Aus der Auflösung einer renommierten Bibliothek. Kann Stempel beinhalten. | Seiten: 124 | Sprache: Deutsch | Produktart: Bücher.
EUR 34,18
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Hardcover. Condizione: Très bon. Ancien livre de bibliothèque. Légères traces d'usure sur la couverture. Edition 1991. Ammareal reverse jusqu'à 15% du prix net de cet article à des organisations caritatives. ENGLISH DESCRIPTION Book Condition: Used, Very good. Former library book. Slight signs of wear on the cover. Edition 1991. Ammareal gives back up to 15% of this item's net price to charity organizations.
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Aggiungi al carrelloCondizione: New. pp. 132.
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Aggiungi al carrelloCondizione: New. pp. 114.
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Aggiungi al carrelloCondizione: New. pp. 114.
Da: Biblios, Frankfurt am main, HESSE, Germania
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Aggiungi al carrelloCondizione: New. pp. 114.
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Three-Dimensional Simulation of Semiconductor Devices | Wolfgang Bergner (u. a.) | Taschenbuch | 124 S. | Deutsch | 2012 | Springer Basel | EAN 9783034877329 | Verantwortliche Person für die EU: Springer Basel AG in Springer Science + Business Media, Heidelberger Platz 3, 14197 Berlin, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: Lakeside Books, Benton Harbor, MI, U.S.A.
EUR 21,34
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Aggiungi al carrelloCondizione: New. Brand New! Not Overstocks or Low Quality Book Club Editions! Direct From the Publisher! We're not a giant, faceless warehouse organization! We're a small town bookstore that loves books and loves it's customers! Buy from Lakeside Books!
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
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Da: Mispah books, Redhill, SURRE, Regno Unito
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Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: moluna, Greven, Germania
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. 1 Introduction.- 2 Basic Physical Models.- 3 Discretization.- 4 Numerical Solution.- 5 Examples.The three-dimensional device simulation has become a necessary tool for the design and investigation of complex device structures. The evolution of the t.
Editore: Springer, Basel, Birkhäuser Basel, Birkhäuser Dez 2012, 2012
ISBN 10: 3034877323 ISBN 13: 9783034877329
Lingua: Tedesco
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 32,99
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The three-dimensional device simulation has become a necessary tool for the design and investigation of complex device structures. The evolution of the three-dimensional simulation tools is directly linked to the scaling of the devices and the increasing complex ity of dynamic random access memory (DRAM) cells. Scaling of MOSFET devices led to a three-dimensional geometry with effects which cannot be handled by two-dimensional simulations anymore. With increasing integration density in DRAMs the third dimen sion had to be utilized to realize the storage capacitor. The result ing leakage problems have to be investigated and the cell design optimized by means of three-dimensional simulations. This book is intended for senior undergraduate students in applied physics, electrical engineering and computational physics, as well as for scientists and engineers involved in semiconductor device re search and development. It is also intended for software engineers and all those who are concerned with simulation. The book will give an overview on the problems and activities con cerning three-dimensional device simulation, without the claim of being a classical textbook. It starts from the classical semiconduc tor equations, discusses the physical models used in device simu lation, describes the discretization and some numerical methods for solving the differential equations. The application of the three dimensional simulation to VLSI device engineering is illustrated by a few specific examples. 124 pp. Deutsch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 52,60
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Aggiungi al carrelloCondizione: New. Print on Demand pp. 132.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 54,38
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Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 132.