Condizione: Good. 678 pp., Hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Hardcover. Condizione: New. US SELLER SHIPS FAST FROM USA.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 53,14
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Soft cover. Condizione: New. US SELLER SHIPS FAST FROM USA.
Da: Revaluation Books, Exeter, Regno Unito
EUR 84,38
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Aggiungi al carrelloPaperback. Condizione: Brand New. revised edition. 200 pages. 9.25x6.10x0.46 inches. In Stock.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 102,53
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 103,12
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 103,12
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 103,53
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Aggiungi al carrelloCondizione: New.
Editore: Springer Berlin Heidelberg, 2014
ISBN 10: 3642445098 ISBN 13: 9783642445095
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Editore: Springer Berlin Heidelberg, 2012
ISBN 10: 3642327699 ISBN 13: 9783642327698
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, held in Hong Kong, China, in October 2011. The 10 papers included in the book were carefully reviewed and selected from the 45 full papers and 16 special session papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Da: preigu, Osnabrück, Germania
EUR 50,35
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. VLSI-SoC: The Advanced Research for Systems on Chip | 19th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2011, Hong Kong, China, October 3-5, 2011, Revised Selected Papers | Salvador Mir (u. a.) | Taschenbuch | x | Englisch | 2014 | Springer Berlin | EAN 9783642445095 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 109,64
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Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 122,35
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 109,63
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 113,71
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 115,47
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Aggiungi al carrelloCondizione: New. In.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 103,67
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Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 103,67
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Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Germania
EUR 125,00
Quantità: 1 disponibili
Aggiungi al carrellogebundene Ausgabe. Condizione: Gut. 477 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 800.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 125,57
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Editore: Springer Berlin Heidelberg, 2012
ISBN 10: 3642327699 ISBN 13: 9783642327698
Lingua: Inglese
Da: Buchpark, Trebbin, Germania
EUR 41,68
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 138,77
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Aggiungi al carrelloCondizione: New. In.
Da: Revaluation Books, Exeter, Regno Unito
EUR 152,07
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 316 pages. 9.00x6.00x0.74 inches. In Stock.
Da: Revaluation Books, Exeter, Regno Unito
EUR 152,52
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 354 pages. 9.25x6.25x0.75 inches. In Stock.
Da: moluna, Greven, Germania
EUR 116,23
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Aggiungi al carrelloGebunden. Condizione: New. Most up-to-date research on microelectronics designThis book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, .
Da: Revaluation Books, Exeter, Regno Unito
EUR 155,13
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 1st edition. 344 pages. 9.25x6.25x1.00 inches. In Stock.
Da: preigu, Osnabrück, Germania
EUR 95,80
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. VLSI-SOC: From Systems to Chips | IFIP TC 10/WG 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (VLSI-SoC 2003), December 1-3, 2003, Darmstadt, Germany | Manfred Glesner (u. a.) | Taschenbuch | x | Englisch | 2010 | Humana | EAN 9781441941268 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: preigu, Osnabrück, Germania
EUR 95,80
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. VLSI-SoC: From Systems to Silicon | IFIP TC10/ WG 10.5 Thirteenth International Conference on Very Large Scale Integration of System on Chip (VLSI-SoC2005), October 17-19, 2005, Perth, Australia | Ricardo Reis (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer US | EAN 9781441944672 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 112,94
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12\* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.