Descrizione libro Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. 364 pp. Englisch. Codice articolo 9783319793054

Informazioni sul venditore | Contatta il venditore

Compra nuovo

EUR 53,49

Convertire valuta

Aggiungere al carrello

Spese di spedizione: EUR 23,00

Da: Germania a: U.S.A.

Destinazione, tempi e costi

Immagini fornite dal venditore

3D Stacked Chips : From Emerging Processes to Heterogeneous Systems

Gerhard Fettweis

Editore: Springer International Publishing (2018)

ISBN 10: 3319793055 ISBN 13: 9783319793054

Nuovo Taschenbuch Quantit�: 1

Da:

AHA-BUCH GmbH
(Einbeck, Germania)

Valutazione libreria

Valutazione venditore:

Descrizione libro Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. Codice articolo 9783319793054

Informazioni sul venditore | Contatta il venditore

Compra nuovo

EUR 58,10

Convertire valuta

Aggiungere al carrello

Spese di spedizione: EUR 32,99

Da: Germania a: U.S.A.

Destinazione, tempi e costi

Immagini fornite dal venditore

3D Stacked Chips

Elfadel, Ibrahim (Abe) M.|Fettweis, Gerhard

Editore: Springer International Publishing (2018)

ISBN 10: 3319793055 ISBN 13: 9783319793054

Nuovo Brossura Quantit�: > 20

Print on Demand

Da:

moluna
(Greven, Germania)

Valutazione libreria

Valutazione venditore:

Descrizione libro Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systemsExplains the use of wireless 3D integration to improve 3D IC reliability and yieldDescribes techniques for monitoring a. Codice articolo 448754751

Informazioni sul venditore | Contatta il venditore

Compra nuovo

EUR 47,23

Convertire valuta

Aggiungere al carrello

Spese di spedizione: EUR 48,99

Da: Germania a: U.S.A.

Destinazione, tempi e costi

Foto dell'editore