Articoli correlati a Development of ultra-fine grain structure in low SFE...
Development of ultra-fine grain structure in low SFE Cu alloys: REVA University Bangalore - Brossura
- EditoreLAP LAMBERT Academic Publishing
- Data di pubblicazione2018
- ISBN 10 3659822809
- ISBN 13 9783659822803
- RilegaturaCopertina flessibile
- Numero di pagine56
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Development of ultra-fine grain structure in low SFE Cu alloys
Editore:
LAP LAMBERT Academic Publishing Sep 2018
(2018)
ISBN 10: 3659822809
ISBN 13: 9783659822803
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Taschenbuch
Quantità: 2
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Descrizione libro Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -There is a great technological interest in bulk-size ultrafine grained (UFG) materials (100-1000 nm) due to their superior mechanical properties in terms of strength, ductility and toughness as compared to their coarse grained counterparts. Copper-based alloys with UFG microstructure is imperative for the high strength and elevated temperature applications such as marine fittings, electrical switch gears, heat exchanger, aircraft and automobile industries. But, mechanical strength of conventional grained Cu-based alloys is limited although its ductility is quite high. Further improvement of the strength could be achieved via grain size refinement as per the Hall-Petch relationship through several severe plastic deformation techniques. Therefore, aim of the present work is to investigate various mechanical properties, especially tensile strength, fracture toughness and fatigue strength of low stacking fault energy (SFE) UFG Cu-Zn and Cu-Al alloys processed by cryorolling (CR) and multiaxial cryoforging (CF) followed by shortannealing. 56 pp. Englisch. Codice articolo 9783659822803
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Development of ultra-fine grain structure in low SFE Cu alloys : REVA University Bangalore
Editore:
LAP LAMBERT Academic Publishing
ISBN 10: 3659822809
ISBN 13: 9783659822803
Nuovo
Taschenbuch
Quantità: 1
Da:
Valutazione libreria
Descrizione libro Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - There is a great technological interest in bulk-size ultrafine grained (UFG) materials (100-1000 nm) due to their superior mechanical properties in terms of strength, ductility and toughness as compared to their coarse grained counterparts. Copper-based alloys with UFG microstructure is imperative for the high strength and elevated temperature applications such as marine fittings, electrical switch gears, heat exchanger, aircraft and automobile industries. But, mechanical strength of conventional grained Cu-based alloys is limited although its ductility is quite high. Further improvement of the strength could be achieved via grain size refinement as per the Hall-Petch relationship through several severe plastic deformation techniques. Therefore, aim of the present work is to investigate various mechanical properties, especially tensile strength, fracture toughness and fatigue strength of low stacking fault energy (SFE) UFG Cu-Zn and Cu-Al alloys processed by cryorolling (CR) and multiaxial cryoforging (CF) followed by shortannealing. Codice articolo 9783659822803
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Development of ultra-fine grain structure in low SFE Cu alloys
Editore:
LAP LAMBERT Academic Publishing
(2018)
ISBN 10: 3659822809
ISBN 13: 9783659822803
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Brossura
Quantità: > 20
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Descrizione libro Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: S. Mabrukar DasharathDr. Dasharath S. M. is an Assistant Professor in the School of Mechanical Engg., REVA University, Bangalore. He obtained BE in Mechanical Engineering from VTU Belgaum, Masters in Manufacturing Engineering from Na. Codice articolo 385769589
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