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Editore: Berlin/Heidelberg, Springer., 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Antiquariat im Hufelandhaus GmbH vormals Lange & Springer, Berlin, Germania
Libro
25 cm. XIX, 325 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: booksXpress, Bayonne, NJ, U.S.A.
Libro
Hardcover. Condizione: new.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Ria Christie Collections, Uxbridge, Regno Unito
Libro Print on Demand
Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: GreatBookPrices, Columbia, MD, U.S.A.
Libro
Condizione: New.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: GreatBookPricesUK, Castle Donington, DERBY, Regno Unito
Libro
Condizione: New.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Libro
Condizione: New.
Editore: Springer Berlin Heidelberg, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: moluna, Greven, Germania
Libro
Gebunden. Condizione: New.
Editore: Springer Berlin Heidelberg Apr 2015, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Libro Print on Demand
Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The field of packaging of photonic devices is very broad and diverse. This book is the first and only comprehensive sourcebook on photonic assembly techniques. For photonic packaging experts and professionals in corresponding technologies, it provides an overview of today's state-of-the-art technologies. From basic calculations to optimize the fiber chip coupling efficiency, the content will guide the reader to the practical use of optical connectors. Active and passive adjustment and coupling basics in combination with many examples will help the engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of actual industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Up to date simulation techniques like FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects. 348 pp. Englisch.
Editore: Springer Berlin Heidelberg, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: AHA-BUCH GmbH, Einbeck, Germania
Libro
Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The field of packaging of photonic devices is very broad and diverse. This book is the first and only comprehensive sourcebook on photonic assembly techniques. For photonic packaging experts and professionals in corresponding technologies, it provides an overview of today's state-of-the-art technologies. From basic calculations to optimize the fiber chip coupling efficiency, the content will guide the reader to the practical use of optical connectors. Active and passive adjustment and coupling basics in combination with many examples will help the engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of actual industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Up to date simulation techniques like FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Books Puddle, New York, NY, U.S.A.
Libro
Condizione: New.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Speedyhen, London, Regno Unito
Libro
Condizione: NEW.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: California Books, Miami, FL, U.S.A.
Libro
Condizione: New.
Editore: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
Libro
Condizione: New. Photonic Packaging Sourcebook Num Pages: 344 pages, 271 black & white illustrations, 16 colour illustrations, biography. BIC Classification: TJF; TTB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 21. Weight in Grams: 684. . 2015. 2013. Hardback. . . . .
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Revaluation Books, Exeter, Regno Unito
Libro
Hardcover. Condizione: Brand New. 2015 edition. 320 pages. 9.25x6.25x1.00 inches. In Stock.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Majestic Books, Hounslow, Regno Unito
Libro Print on Demand
Condizione: New. Print on Demand.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: GreatBookPricesUK, Castle Donington, DERBY, Regno Unito
Libro
Condizione: As New. Unread book in perfect condition.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Mispah books, Redhill, SURRE, Regno Unito
Libro
Hardcover. Condizione: Like New. Like New. book.
Editore: Springer, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: GreatBookPrices, Columbia, MD, U.S.A.
Libro
Condizione: As New. Unread book in perfect condition.
Editore: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, 2015
ISBN 10: 364225375XISBN 13: 9783642253751
Da: Kennys Bookstore, Olney, MD, U.S.A.
Libro
Condizione: New. Photonic Packaging Sourcebook Num Pages: 344 pages, 271 black & white illustrations, 16 colour illustrations, biography. BIC Classification: TJF; TTB. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 21. Weight in Grams: 684. . 2015. 2013. Hardback. . . . . Books ship from the US and Ireland.