Electronic Packaging: Design, Materials, Process, and Reliability - Rilegato

Nakayama, Wataru; Prince, J. L.; Wong, Christine P. W.

Rilegato

ISBN 10: 0070371350 ISBN 13: 9780070371354

Casa editrice: McGraw-Hill, 1998

Riassunto

A summary of the state of knowledge in electronic packaging and interconnections. Topics include trends in integrated circuits (ICs), basic transmission line characteristics, power and ground bus disturbances, thermal analysis and design, thermal mechanical boundary value problems, finite element analysis, hermetic microwave packages, polymers for electronic packaging, and anisotropically conductive adhesives for microelectronic assembly. Intended as a reference for professionals faced with the problems created by ever increasing IC speed and density and the reduction of product size and weight. Annotation c. by Book News, Inc., Portland, Or.

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Informazioni sull?autore

Dr. John H. Lau is President of Express Packaging Systems, Inc. He previously worked for Hewlett-Packard Company. Dr. C.P. Wong is a professor of Materials Science and Engineering at the Georgia Institute of technology. He is a past President of the IEEE-CPMT Society and has done research at AT&T. Dr. John Prince is Professor of Electrical and Computer Engineering and Director of the Center for Electronic Packaging Research at the University of Arizona. Dr. Warren Nakayama is a professor at the CALCE Electronic Packaging Research Center at the University of Maryland. He previously worked for Hitachi Ltd.

Dettagli dell'edizione

• Editore: McGraw-Hill
• Data di pubblicazione: 1998
• Lingua: Inglese
• ISBN 10: 0070371350
• ISBN 13: 9780070371354
• Rilegatura: Copertina rigida
• Numero di pagine: 498
• Redattore: Lau John H.
• Contatto del produttore: non disponibile
• Persona responsabile: Ufficio Anagrafiche Messaggerie; 0039 0245774342; ufficio.anagrafiche@meli.it; ; Via Verdi, 8.; Assago Milano; 20090; Italia