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The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement. This work describes MCM technology, as well as showing designers how to use it in practice. The guide covers practical issues such as electrical testing, rework procedures and failure modes and mechanisms.
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Book by Licari James J
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Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
Da: -OnTimeBooks-, Phoenix, AZ, U.S.A.
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Condizione: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail. Codice articolo OTV.0070377154.VG
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