Sinossi
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement. This work describes MCM technology, as well as showing designers how to use it in practice. The guide covers practical issues such as electrical testing, rework procedures and failure modes and mechanisms.
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Book by Licari James J
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Multichip Module Design, Fabrication, and Testing (Electronic Packaging and Interconnection)
Da: HPB-Red, Dallas, TX, U.S.A.
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hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Codice articolo S_377209750
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