This book provides a completed technician-level explanation of the major issues and processes in semiconductor fabrication for non-engineers working in fabrication support functions, such as operations, planning, quality control, and technical personnel. Readers will also find invaluable coverage of wafer test and evaluation, manufacturing technology, semiconductor devices and structures, integrated circuit types, and chip packaging. Entirely updated and expanded to reflect all recent developments, this book is based on a seminar attended by over 800 technicians and other personnel.
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Book by Van Zant Peter
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Da: GoldBooks, Denver, CO, U.S.A.
Hardcover. Condizione: very good. Very Good Copy. Customer Service Guaranteed. Codice articolo 39B9_1_007067194X
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Condizione: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail. Codice articolo OTV.007067194X.VG
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Da: Better World Books: West, Reno, NV, U.S.A.
Condizione: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Codice articolo 40098794-6
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Da: BooksRun, Philadelphia, PA, U.S.A.
Hardcover. Condizione: Fair. 2nd. The item might be beaten up but readable. May contain markings or highlighting, as well as stains, bent corners, or any other major defect, but the text is not obscured in any way. Markings in workbook. Codice articolo 007067194X-7-1-117
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Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
hardcover. Condizione: New. In shrink wrap. Looks like an interesting title! Codice articolo Q-007067194x
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