The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Editionexplains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technologicalbackbone of the high-tech industry.
COVERAGE INCLUDES:
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Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. He is the principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry. Van Zant’s books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers have included Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions.
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Spese di spedizione:
EUR 9,24
In U.S.A.
Descrizione libro Soft cover. Condizione: New. Condizione sovraccoperta: New. International Edition. **INTERNATIONAL EDITION** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments go through via USPS/UPS/DHL with tracking numbers. Great professional textbook selling experience and expedite shipping service. Codice articolo ABE-14799751152
Descrizione libro Trade paperback. Condizione: New in new dust jacket. 6th Revised ed. INTERNATIONAL EDITION. ***INTERNATIONAL EDITION*** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments contain tracking numbers. Great professional textbook selling experience and expedite shipping service. Glued binding. Paper over boards. 548 p. Contains: Illustrations, black & white, Figures. Audience: General/trade. Codice articolo K0080000970
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Descrizione libro Hardcover. Condizione: new. Hardcover. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.COVERAGE INCLUDES:The semiconductor industryProperties of semiconductor materials and chemicalsCrystal growth and silicon wafer preparationWafer fabrication and packagingContamination controlProductivity and process yieldsOxidationThe ten-step patterning process--surface preparation to exposure; developing to final inspectionNext generation lithographyDopingLayer depositionMetallizationProcess and device evaluationThe business of wafer fabricationDevices and integrated circuit formationIntegrated circuitsPackaging Fully revised to cover the latest advances in the field, this new edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. Detailed illustrations and real-world examples are included. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Codice articolo 9780071821018
Descrizione libro Condizione: New. Codice articolo I-9780071821018
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Descrizione libro Hardcover. Condizione: new. New. Fast Shipping and good customer service. Codice articolo Holz_New_0071821015
Descrizione libro Hardcover. Condizione: new. Prompt service guaranteed. Codice articolo Clean0071821015