Containing the most recent advances in the field written by the experts from AT&T Bell Labs, Hitachi, and IBM Watson, this book provides in-depth coverage of photoresists for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging, and electronic and photonic applications of polymeric materials. Written for engineers, but also useful to hybrid and systems packaging managers. Annotation copyright Book News, Inc. Portland, Or.
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Condizione: Acceptable. Used - Acceptable. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library with wear and barcode page may have been removed. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions. Codice articolo Z1-A-010-03502
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hardcover. Condizione: Good. GOOD. Blue cloth hard cover board. Approx. 9" x 6". Bumps/chips to edges and corners. Rub wear, dust markings and light scratches to covers. Small creases to top right corner. Once Read Books, cover scan available - just ask, OnceReadBooks com Orders shipped via USPS. Codice articolo 334337
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