This book describes in the simplest possible terms, the signal integrity problems and the fundamental principles needed to understand how the physical design influences signal integrity. Most easily defined, signal integrity is all about how the physical design of the interconnects -- printed circuit board traces, connectors, IC packages and cables -- corrupt the perfect, pristine signals coming off the chips. The electrical properties of the interconnects play a key role in all electronic products operating above 50 MHz clock frequency, such as computers, wireless, rf and telecommunications products. Interconnects can degrade the electrical performance of a system in four ways: ringing, cross talk, noise in the power and ground distribution network and electromagnetic interference (EMI). These signal integrity problems can be reduced to acceptable levels by careful design of the circuit board layout, materials selection and component design and selection. Any product designer that touches the product can have an impact on signal integrity. The key differentiator between our book and all the others written on signal integrity, is the starting level for the material.Most books either present a lot of mathematical derivation or present formulas as facts, merely describing what they are. Bogatin's book offers explanations that will feed the intuition of the engineers, without hiding behind the equations.
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ERIC BOGATIN, Chief Technology Officer at GigaTest Labs, has over 23 years of experience in the microelectronics industry. Before joining GigaTest, he worked with AT&T Bell Labs, Raychem Corporation, Sun Microsystems, and other leading microelectronics manufacturers. He received his B.S. degree in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Over the years, he has taught over 3,000 engineers and authored over 100 technical articles and books on signal integrity and interconnect design.
The complete guide to understanding and designing for signal integrity
Suitable for even non-specialists, Signal Integrity Simplified offers a comprehensive, easy-to-follow look at how physical interconnects affect electrical performance. World-class engineer Eric Bogatin expertly reviews the root causes of the four families of signal integrity problems and offers solutions to design them out early in the design cycle. Coverage includes:
Unlike related books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Specially designed for everyone in the electronics industry, from electrical engineers to product managers, Signal Integrity Simplified will prove itself an invaluable resource for helping you find and fix signal integrity problems before they become problems.
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Da: Goodwill of Ventura and Santa Barbara Counties, Oxnard, CA, U.S.A.
Condizione: good. Good: The book has been read but is in good condition. It has very minimal damage to the cover, including scuff marks, but no holes or tears. The dust jacket for hard covers may not be included. The binding has minimal wear. The majority of pages are undamaged with minimal creasing or tearing, minimal pencil underlining of text, no highlighting of text, and no writing in the margins. There are no missing pages. See the seller's listing for full details and a description of any imperfections. Codice articolo VSBV.0130669466.G
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