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Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1971 (Classic Reprint) - Brossura
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Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1971
The report of each task includes the long - term objective, a narra tive description of progress made during this reporting period, and a listing of plans for the immediate future. Additional information con cerning the material reported may be obtained directly from individual staff members connected with the task as indicated throughout the report. The organization of the Joint Program staff and telephone numbers are listed in Appendix A.
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Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1971 (Classic Reprint)
Da: PBShop.store US, Wood Dale, IL, U.S.A.
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PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000. Codice articolo LW-9780260648341
Quantità: 15 disponibili
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Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1971 (Classic Reprint)
Da: PBShop.store UK, Fairford, GLOS, Regno Unito
Valutazione del venditore 5 su 5 stelle
PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000. Codice articolo LW-9780260648341
Quantità: 15 disponibili
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Methods of Measurement for Semiconductor Materials, Process Control, and
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Paperback. Condizione: New. Print on Demand. This book summarizes progress made in the Joint Program on Methods of Measurement for Semiconductor Materials, Process Control, and Devices. Topics covered include techniques such as infrared methods, thermal property measurements, and wire bonding evaluation. The author covers the research and development of techniques for use throughout the electronics industry for measuring resistivity of bulk, epitaxial, and diffused silicon wafers. This book also delves into methods for studying wire bond systems in semiconductor devices, such as destructive pull testing and the impact of bonding tool motion on wire flexure. The research presented in this book is significant because it provides valuable insights into the development and refinement of measurement methods for semiconductor materials, process control, and devices, ultimately contributing to advancements in the electronics industry. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item. Codice articolo 9780260648341_0
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