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Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1972 (Classic Reprint) - Brossura
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Excerpt from Methods of Measurement for Semiconductor Materials, Process Control, and Devices: Quarterly Report, July 1 to September 30, 1972
Key wards: Aluminum wire; base transit time; carrier lifetime; die attach ment; electrical properties; epitaxial silicon; gamma - ray detectors; gen eration centers; germanium; gold-doped silicon; infrared response; methods of measurement; microelectronics; microwave diodes; nuclear radiation de tectors; probe techniques (aéc); recombination centers; resistivity; ribbon wire bonding; semiconductor devices; semiconductor materials; semiconductor process control; silicon; thermal resistance; trapping centers; ultrasonic bonding; wire bonds.
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Methods of Measurement for Semiconductor Materials, Process Control, and Devices
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PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000. Codice articolo LW-9780332613680
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Methods of Measurement for Semiconductor Materials, Process Control, and Devices
Da: PBShop.store UK, Fairford, GLOS, Regno Unito
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PAP. Condizione: New. New Book. Shipped from UK. Established seller since 2000. Codice articolo LW-9780332613680
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Methods of Measurement for Semiconductor Materials, Process Control, and Devices : Quarterly Report, July 1 to September 30, 1972 (Classic Reprint)
Da: Buchpark, Trebbin, Germania
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Condizione: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher. Codice articolo 30696973/1
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Methods of Measurement for Semiconductor Materials, Process Control, and
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Paperback. Condizione: New. Print on Demand. This book approaches semiconductor device fabrication, process control, and testing from a unique engineering perspective that emphasises the importance of materials characterisation and quality control to overall device performance. The author draws extensively on his own research in the Joint Program on Methods of Measurement for Semiconductor Materials, Process Control, and Devices to explore key concepts in device testing, particularly thermal properties, lifetime, defects, and bonding integrity. These methodologies are integral to the production of reliable devices, and their exploration makes up the main body of the work. The author draws attention to the importance of standardisation and collaboration between academics, researchers, and policymakers, highlighting the role played by ASTM and other similar international organizations in establishing measurement standards for semiconductor materials and processes. A significant reference work summarising and synthesising the author's research in a field where he is an undoubted global authority. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item. Codice articolo 9780332613680_0
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