Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices: Nbs Technical Note 785 (Classic Reprint) - Brossura
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Excerpt from Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices: Nbs Technical Note 785
Of the several hundred sem photographs made, the examples shown were selected to be indicative of particular faults. It is not intended to suggest that the faults illustrated are unique to a particular device type, production line, or circuit configuration. In fact, most of the faults were observed to some extent in all types of the devices investi gated.
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Scanning Electron Microscope Examination of Wire Bonds From High-Reliability
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Paperback. Condizione: New. Print on Demand. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item. Codice articolo 9780364024744_0
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Scanning Electron Microscope Examination of Wire Bonds From HighReliability Devices Nbs Technical Note 785 Classic Reprint
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Scanning Electron Microscope Examination of Wire Bonds From HighReliability Devices Nbs Technical Note 785 Classic Reprint
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