Interconnect Noise Optimization in Nanometer Technologies - Rilegato

Bayoumi, Magdy A.; Elgamel, Mohamed

 
9780387258706: Interconnect Noise Optimization in Nanometer Technologies
Rilegato
ISBN 10: 0387258701 ISBN 13: 9780387258706
Casa editrice: Springer-Verlag GmbH, 2005

Sinossi

Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.

The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Dalla quarta di copertina

Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits.

The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
Springer-Verlag GmbH
Data di pubblicazione
2005
Lingua
Inglese
ISBN 10 
0387258701
ISBN 13 
9780387258706
Rilegatura
Copertina rigida
Numero di pagine
160
Contatto del produttore
non disponibile
Persona responsabile
Springer Nature Customer Service Center GmbH
ProductSafety@springernature.com

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Heidelberg
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Germania

Altre edizioni note dello stesso titolo

9781441938442: Interconnect Noise Optimization in Nanometer Technologies

Edizione in evidenza

ISBN 10:  1441938443 ISBN 13:  9781441938442
Casa editrice: Springer, 2010
Brossura