Solder Joint Reliability Prediction for Multiple Environments - Rilegato

Perkins, Andrew Eugene; Sitaraman, Suresh K.

Rilegato

ISBN 10: 0387793933 ISBN 13: 9780387793931

Casa editrice: Springer Nature, 2008

Riassunto

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

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Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.  The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability.  Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability, including:

A comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability,

Useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling, and power cycling enviroments,

New insight into solder joint reliability testing under multiple environments, including vibration environments,

A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type.

Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder.

Dettagli dell'edizione

• Editore: Springer Nature
• Data di pubblicazione: 2008
• Lingua: Inglese
• ISBN 10: 0387793933
• ISBN 13: 9780387793931
• Rilegatura: Copertina rigida
• Numero di pagine: 192
• Contatto del produttore: non disponibile
• Persona responsabile: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3,69115 Heidelberg, Germany; Heidelberg; 69115; Germania