Manufacturing Technology in the Electronics Industry: An Introduction - Brossura

Edwards, P.

Brossura

ISBN 10: 0412371308 ISBN 13: 9780412371301

Casa editrice: Springer, 2013

Riassunto

Primarily concerned with the manufacturing aspects of the electronics industry, this work is designed to serve as an introductory text on manufacturing processes for trainee or student manufacturing engineers, as well as electrical engineers concerned with the manufacturing side. Starting with the individual electronic components, the text addresses the design processes involved, the fabrication of semiconductor devices and the manufacture of complete printed circuit boards. It concludes with a discussion of non-standard electronic devices and interconnection methods.

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Contenuti

1 Introduction to the electronics industry.- 1.1 A history of the electronics industry.- 1.2 The electronics market.- 1.3 Electronics manufacturing company structure.- 1.4 Test engineering and quality assurance.- 2 Electronic components.- 2.1 Component interconnection methods.- 2.2 Electronic components.- 2.3 Component packaging.- 2.4 Cabling.- 2.5 Component quality assurance.- 3 Electronic design.- 3.1 Quality and reliability assessment.- 3.2 The product design process.- 3.3 Circuit design.- 3.4 Integrated circuit design.- 3.5 Circuit layout.- 4 Semiconductor device manufacture.- 4.1 Semiconductor materials.- 4.2 Clean room requirements.- 4.3 Silicon wafer manufacture.- 4.4 Photolithography.- 4.5 Layer fabrication processes.- 4.6 Bipolar junction transistor fabrication.- 4.7 Field effect transistor fabrication.- 4.8 Integrated circuit packaging and testing.- 5 Printed circuit board manufacture.- 5.1 Printed circuit board types.- 5.2 Printed circuit board substrate materials.- 5.3 Printed circuit board substrate manufacture.- 5.4 Printed circuit board fabrication procedures.- 5.5 Single-sided printed circuit board manufacture.- 5.6 Double-sided printed circuit board manufacture.- 5.7 Multilayer printed circuit board manufacture.- 6 Printed circuit board assembly.- 6.1 Hand assembly.- 6.2 Automatic component insertion.- 6.3 Assembly-related faults.- 6.4 Soldering techniques.- 6.5 Solder joint inspection and common soldering faults.- 6.6 Cleaning.- 6.7 Testing and reworking.- 7 Surface mount component assembly.- 7.1 Advantages of surface mount components.- 7.2 Surface mount component assembly.- 7.3 Adhesive application.- 7.4 Solder paste application.- 7.5 Component onsertion.- 7.6 Soldering techniques.- 7.7 Mixing surface mount with leaded components.- 7.8 Soldering quality.- 7.9 Testing.- 7.10 Reworking.- 8 Alternative technologies.- 8.1 Hybrid technology.- 8.2 Tape automated bonding.- 8.3 Silicon on silicon wafer-scale integration.- 8.4 Application-specific integrated circuits.- 8.5 Flexible circuits.- References.- Further reading.

Dettagli dell'edizione

• Editore: Springer
• Data di pubblicazione: 2013
• Lingua: Inglese
• ISBN 10: 0412371308
• ISBN 13: 9780412371301
• Rilegatura: Copertina flessibile
• Numero edizione: 1
• Numero di pagine: 256
• Contatto del produttore: non disponibile
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